ISD1616BSY01 datasheet, PDF - EEWORLD Datasheet

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ISD1616BSY01: Descriptionsingle-message single-chip 6.6- to 40-second voice record & playback devices with valert option; CategoryAnalog mixed-signal IC Consumption circuit; File Size307KB，23 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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ISD1616BSY01 Overview

single-message single-chip 6.6- to 40-second voice record & playback devices with valert option

ISD1616BSY01 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknow
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDSO-G16
length	9.9 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	16
On-chip memory type	FLASH
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum read time	30 s
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.4 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3.9 mm

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PRELIMINARY

ISD1600B

Series

Single-Message

Single-Chip

6.6- to 40-Second

Voice Record & Playback Devices

with vAlert Option

Publication Release Date: Jan. 23, 2007

Revision 1.2

ISD1600B SERIES

TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 3

2. FEATURES ......................................................................................................................................... 4

3. BLOCK DIAGRAM .............................................................................................................................. 5

4. PIN CONFIGURATION ....................................................................................................................... 6

5. PIN DESCRIPTION ............................................................................................................................. 7

6. FUNCTIONAL DESCRIPTION............................................................................................................ 9

6.1. Detailed Description .................................................................................................................... 9

6.1.1 Audio Quality....................................................................................................................... 9

6.1.2 Duration............................................................................................................................... 9

6.1.3 Flash Storage...................................................................................................................... 9

6.1.4 Basic Operation .................................................................................................................. 9

6.1.5 vAlert ................................................................................................................................... 9

6.1.6 Automatic Power-Down Mode ............................................................................................ 9

6.2. Functional Description Example................................................................................................ 10

6.2.1. Record a Message........................................................................................................... 10

6.2.2. Edge-trigger Playback...................................................................................................... 10

6.2.3. Level- trigger Playback .................................................................................................... 10

6.2.4. LED Operation ................................................................................................................. 10

6.2.5. R

OSC

Operation................................................................................................................. 10

7. TIMING DIAGRAMS.......................................................................................................................... 11

8. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 13

8.1 Operating Conditions.................................................................................................................. 14

9. ELECTRICAL CHARACTERISTICS ................................................................................................. 15

9.1. DC Parameters.......................................................................................................................... 15

9.2. AC Parameters .......................................................................................................................... 16

10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 17

11. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 18

11.1. 16-Lead 150mil Small Outline Integrated Circuit (SOIC) Package ......................................... 18

11.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)............................................................... 19

11.3. Die Physical Layout ................................................................................................................. 20

12. ORDERING INFORMATION........................................................................................................... 21

13. VERSION HISTORY ....................................................................................................................... 22

-2-

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