TD62386,387,388APG/AFG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62386APG,TD62386AFG,TD62387APG
TD62387AFG,TD62388APG,TD62388AFG
8 Ch Low Input Active Darlington Sink Driver
The TD62386APG, TD62386AFG, TD62387APG, TD62387AFG
and TD62388APG, TD62388AFG are non−inverting transistor
arrays, which are comprised of eight NPN darlington output
stages and PNP input stages.
All units feature integral clamp diodes for switching inductive
loads.
These devices are Low Level input active drivers and are suitable
for operations with TTL, 5 V CMOS and 5 V Microprocessor
which have sink current output drivers.
Applications include relay, hammer, lamp and LED driver.
TD62386APG
TD62387APG
TD62388APG
Features
•
•
•
•
•
•
•
•
Output current (single output) 500 mA (Max)
High sustaining voltage 50 V (Min)
Output clamp diodes
Low level active input
Standard supply voltage
Inputs compatible with TTL and 5 V CMOS
Package type−APG:
Package type−AFG:
DIP−20 pin
SOP−20 pin
TD62386AFG
TD62387AFG
TD62388AFG
TYPE
TD62386APG, TD62386AFG
TD62387APG, TD62387AFG
TD62388APG, TD62388AFG
V
IN (ON)
−20
V to V
CC
−
2.8 V
0 V to V
CC
−
3.7 V
Weight
DIP20−P−300−2.54A : 2.25 g (Typ.)
SOP20−P−300−1.27 : 0.25 g (Typ.)
Pin Connection
(top view)
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2007-07-03
TD62386,387,388APG/AFG
Schematics
(each driver)
TD62386APG, TD62386AFG
TD62387APG, TD62387AFG
TD62388APG, TD62388AFG
Note: The output parasitic diode cannot be used as clamp diodes.
Absolute Maximum Ratings
Characteristic
Supply Voltage
Output Sustaining Voltage
Output Current
Input Voltage
Input Current
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
APG
AFG
Symbol
V
CC
V
CE (SUS)
I
OUT
V
IN
(Note 1)
V
IN
(Note 2)
I
IN
V
R
I
F
P
D
(Note 3)
T
opr
T
stg
Rating
−0.5
to 7.0
−0.5
to 50
500
−22
to V
CC
+
0.5
−0.5
to 7
−10
50
500
1.38
1.0 (Note 4)
−40
to 85
−55
to 150
mA
V
mA
W
°C
°C
Unit
V
V
mA/ch
V
Note 1:
Note 2:
Note 3:
Note 4:
TD62386APG, TD62386AFG only
TD62387APG, TD62387AFG, TD62388APG, TD62388AFGonly
Delated above 25°C in the proportion of 11.7 mW/°C (APG−Type), 7.7 mW/°C (AFG−Type).
On PCB (50
×
50
×
1.6 mm Cu 40% Glass Epoxy)
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2007-07-03
TD62386,387,388APG/AFG
Operating Conditions
(Ta =
−40~85°C)
Characteristic
Supply Voltage
Output Sustaining Voltage
Output Current
TD62386
Input Voltage
TD62387
TD62388
V
IN
V
R
I
F
P
D
Symbol
V
CC
V
CE (SUS)
I
OUT
Condition
⎯
⎯
Tpw
=
25 ms, Duty
=
10%
8 Circuits
⎯
⎯
⎯
⎯
⎯
(Note 1)
Min
4.5
0
0
−20
0
⎯
⎯
⎯
⎯
Typ.
5.0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Max
5.5
50
270
V
CC
5.5
50
400
0.52
0.4
V
V
mA
W
Unit
V
V
mA/
ch
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
APG
AFG
Note 1: On Glass Epoxy PCB (50
×
50
×
1.6 mm Cu 40%)
Electrical Characteristics
(Ta
=
25°C)
Characteristic
Output Leakage Current
Symbol
I
CEX
V
CE (sat)
Test
Cir−
cuit
1
Test Condition
V
CC
=
5.5 V, I
IN
=
0
V
OUT
=
50 V, Ta
=
85°C
V
CC
=
4.5 V,
V
IN
=
V
IN (ON) MAX.
I
OUT
=
350 mA
V
CC
=
5.5 V, V
IN
=
0.4 V
V
CC
=
5.5 V, V
IN
= −20
V
I
IN (OFF)
4
⎯
⎯
V
IN (ON)
5
⎯
I
R
6
V
R
=
50 V, Ta
=
25°C
V
R
=
50 V, Ta
=
85°C
I
F
=
350 mA
I
F
=
280 mA
V
CC
=
5.5 V, V
IN
=
0
V
CC
=
5.5 V, V
IN
=
V
CC
V
CC
=
5 V, V
OUT
=
50 V
R
L
=
125
Ω,
C
L
=
15 pF
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
17
⎯
0.1
3
Min
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
⎯
Max
100
Unit
µA
Output Saturation Voltage
TD62387
TD62388
TD62386
Common to all
devices
TD62386
TD62387
TD62388
2
1.4
−0.32
⎯
⎯
⎯
2.0
−0.45
−2.6
−4.0
V
CC
−
2.8
V
CC
−
3.7
50
100
2.0
1.8
22
100
⎯
⎯
V
Input
Current
Output
On
Output
Off
I
IN (ON)
3
mA
µA
Input Voltage
(Output on)
V
Clamp Diode Reverse Current
µA
Clamp Diode Forward Voltage
V
F
I
CC (ON)
I
CC (OFF)
t
ON
t
OFF
7
V
mA
µA
µs
Supply Current
Turn−On Delay
Turn−Off Delay
8
9
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2007-07-03
TD62386,387,388APG/AFG
Test Circuit
1. I
CEX
2. V
CE (sat)
3. I
IN (ON)
4. I
IN (OFF)
5. V
IN (ON)
6. I
R
7. V
F
8. I
CC
9. t
ON,
t
OFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50
Ω,
t
r
≤
5 ns, t
f
≤
10 ns
Note 2: C
L
includes probe and jig capacitance.
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, V
CC
, COMMON and GND line since IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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2007-07-03
TD62386,387,388APG/AFG
TD62386-388APG
5
2007-07-03
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