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TEA1098

Description
speech and handsfree IC
File Size201KB,40 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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TEA1098 Overview

speech and handsfree IC

INTEGRATED CIRCUITS
DATA SHEET
TEA1098
Speech and handsfree IC
Product specification
Supersedes data of 1999 May 20
File under Integrated Circuits, IC03
1999 Oct 14

TEA1098 Related Products

TEA1098 TEA1098H TEA1098UH TEA1098TV
Description speech and handsfree IC speech and handsfree IC speech and handsfree IC speech and handsfree IC
Maker - NXP NXP NXP
Parts packaging code - QFP DIE SOIC
package instruction - QFP, DIE, DIE OR CHIP SSOP, SOP40,.5,30
Contacts - 44 44 40
Reach Compliance Code - unknow unknow unknow
JESD-30 code - S-PQFP-G44 R-XUUC-N44 R-PDSO-G40
Number of functions - 1 1 1
Number of terminals - 44 44 40
Maximum operating temperature - 75 °C 75 °C 75 °C
Minimum operating temperature - -25 °C -25 °C -25 °C
Package body material - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code - QFP DIE SSOP
Package shape - SQUARE RECTANGULAR RECTANGULAR
Package form - FLATPACK UNCASED CHIP SMALL OUTLINE, SHRINK PITCH
Certification status - Not Qualified Not Qualified Not Qualified
Nominal supply voltage - 3 V 3 V 3 V
surface mount - YES YES YES
technology - BIPOLAR BIPOLAR BIPOLAR
Telecom integrated circuit types - TELEPHONE SPEECH CIRCUIT TELEPHONE SPEECH CIRCUIT TELEPHONE SPEECH CIRCUIT
Temperature level - COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal form - GULL WING NO LEAD GULL WING
Terminal location - QUAD UPPER DUAL

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