TD62304,305P/AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62304P,TD62304AP,TD62304F,TD62304AF
TD62305P,TD62305AP,TD62305F,TD62305AF
7CH LOW ACTIVE DARLINGTON SINK DRIVER
The TD62304P/AP/F/AF and TD62305P/AP/F/AF are
non−inverting transistor arrays, which are comprised of eight
NPN darlington buffer-transistor output stages and PNP input
stages.
These devices can be operated by source input voltage and are
suitable for operations with a 5-V general purposed logic IC such
as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink
current output drivers.
Please observe the thermal condition for using.
FEATURES
l
Output current (single output) 500 mA (Max.)
l
High sustaining voltage 35 V (TD62304P/F, 62305P/F) 50 V
(TD62304AP/AF, 62305AP/AF) (Min.)
l
Low level active input
l
Input compatible with 5-V TTL and 5-V CMOS
l
Package type-P, AP: DIP-16 pin
l
Package type-F, AF: SOP-18 pin
PIN CONNECTION
(TOP VIEW)
Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)
SCHEMATICS
(EACH DRIVER)
TD62034P/AP/F/AF
TD62305P/AP/F/AF
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
1
2001-07-16
TD62304,305P/AP/F/AF
RECOMMENDED OPERATING CONDITIONS
CHARACTERISTIC
Supply Voltage
P, F
Output Sustaining Voltage
AF
AP
DC 1 Circuit
P
Output Current
AP
I
OUT
T
pw
= 25 ms, duty = 10%
7 circuits
T
pw
= 25 ms, duty = 10%
7 circuits
T
pw
= 25 ms, duty = 20%
7 circuits
Input Voltage
TD62304P / AP / F / AF
TD62305P / AP / F / AF
P
Power Dissipation
AP
F, AF
P
D
V
IN
―
―
―
(Note 1)
V
CE (SUS)
―
SYMBOL
V
CC
(Ta =
−40~85°C
and Ta =
−30~75°C
for only Type−P)
CONDITION
―
MIN
4.5
0
0
0
0
0
TYP.
5.0
―
―
―
―
―
MAX
5.5
35
50
50
350
300
mA / ch
V
UNIT
V
0
―
350
0
−20
0
―
―
―
―
―
―
―
―
―
200
V
CC
5.5
0.44
0.52
0.325
W
V
Note 1: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
ELECTRICAL CHARACTERISTICS
(Ta = 25°C)
CHARACTERISTIC
P/F
I
CEX
1
SYMBOL
TEST
CIR−
CUIT
TEST CONDITION
V
OUT
= 35 V
Ta = 75°C
V
OUT
= 50 V
Ta = 85°C
MIN
TYP.
MAX
UNIT
Output Leakage
Current
V
CC
= 5.5 V
V
IN
= 0 V
―
―
−100
µA
Output Saturation Voltage
(Output On)
(Output Off)
Input Voltage
(Output On)
TD62304
V
CE (sat)
I
IN (ON)
I
IN (OFF)
2
3
4
V
IN
= V
IN (ON)
V
CC
= 4.5 V
I
OUT
= 350 mA MAX.
V
CC
= 5.5 V, V
IN
= 0.4 V
V
CC
= 5.5 V, V
IN
=
−20
V
―
―
―
―
―
―
1.4
−0.32
―
―
―
―
17
―
2.0
−0.45
−2.6
−40
V
CC
−2.8
V
CC
−3.7
22
100
V
mA
µA
Input Current
V
IN (ON)
TD62305
(Output On)
(Output Off)
P, F
I
CC (ON)
I
CC (OFF)
5
―
―
V
Supply Current
6
6
V
CC
= 5.5 V, V
IN
= 0 V
V
CC
= V
IN
= 5.5 V
V
OUT
= 35 V
R
L
= 87.5
Ω
V
CC
= 5 V,
C
L
= 15 pF
V
OUT
= 50 V
R
L
= 125
Ω
V
OUT
= 35 V
R
L
= 87.5
Ω
V
OUT
= 50 V
R
L
= 125
Ω
―
―
mA
µA
Turn−On Delay
AP, AF
t
ON
7
P, F
―
0.1
―
µs
Turn−Off Delay
AP, AF
t
OFF
―
3
―
3
2001-07-16
TD62304,305P/AP/F/AF
TEST CIRCUIT
1.
I
CEX
2. h
FE
, V
CE (sat)
3. I
IN (ON)
4. I
IN (OFF)
5. V
IN (ON)
6. I
CC
7. t
ON
, t
OFF
Note 1: Pulse Width 50 µs, duty cycle 10%
Output impedance 50
Ω,
t
r
≤
10 ns, t
f
≤
5 ns
Note 2: C
L
includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.Utmost care is
necessary in the design of the output line, V
CC
and GND line since IC may be destroyed due to short−circuit
between outputs, air contamination fault, or fault by improper grounding.
4
2001-07-16
GD32 MCU
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