Glenair’s new 1000 Hour Grey over stainless steel.
Glenair’s standard olive drab zinc-nickel finish.
Glenair’s standard black zinc-nickel finish.
Glenair’s RoHs compliant black zinc-nickel.
Glenair’s standard black cadmium over stainless steel.
Glenair’s standard olive drab cadmium over stainless steel.
1000
1000
1000
1000
500
1000
2000
TABLE I - BACKSHELL INTERFACE DIMENSIONS
A
C*
D
08
E
08
F
08 [9]
G
H
09 [A]
08
08 [A]
03
10
10 [B]
12
12 [7] 12
14
14 [12] 14
16
16 [19] 16
18 [27]
18
20 [37]
20
22
22
22 [H]
24
61
24 [J]
25 [G]
24
28
28
32
32
36
36
40
40
40
44
44
48
48
33 [J]
36
29 [H]
32
28
24
24
24 [25] 23 [F]
25 [J]
24
24
22
22
22 [23]
23 [H]
24
20
20
20 [21]
21 [G]
19 [E]
20 [G]
22
22
22
18
18
18 [19]
19 [F]
17 [D]
18 [F]
20
20
20
16
16 [17]
17 [E]
15 [C]
16 [E]
18
18
18
12
14
12 [13]
13 [C]
11 [A]
14 [15]
15 [D]
13 [B]
14 [D]
16
16
16 [17]
14 [15]
14
14
12
12
10
10
10 [11]
11 [B]
12 [13]
10
11
10
10
J
K
08
L
08
S
08
.770 (19.6)
.890 (22.6)
.890 (22.6)
1.020 (25.9)
1.020 (25.9)
1.150 (29.2)
1.150 (29.2)
1.260 (32.0)
1.230 (31.2)
1.400 (35.6)
1.360 (34.5)
1.530 (38.9)
1.480 (37.6)
1.600 (40.6)
(40.6)
(49.3)
.820 (20.8)
1.060 (26.9)
.820 (20.8)
.940
1.170
.940
1.060
1.290
1.060
(23.8)
(29.7)
(23.8)
(26.9)
(32.7)
(26.9)
1.170 (29.7)
1.420 (36.1)
1.170 (29.7)
1.290 (32.7)
1.540 (39.1)
1.420 (36.0)
1.670 (42.4)
1.540 (39.1)
2.010 (51.1)
1.840 (46.7)
1.970 (50.0)
2.090 (53.1)
2.280 (57.9)
2.340 (59.4)
2.340 (59.4)
2.530 (64.3)
2.590 (65.8)
2.590 (65.8)
2.780 (70.6)
2.910 (73.9)
3.030 (77.0)
3.160 (80.3)
3.220 (81.8)
3.410 (86.6)
1.600
(43.9)
(43.9) 1.940
(43.2)
(42.4)
(49.3)
(46.2)
1.940
1.970 (50.0)
2.190 (55.6) 2.190
2.220 (56.4)
2.440 (62.0) 2.440
2.440
2.47 (62.7)
2.690
2.690
2.720 (69.1)
2.930
2.970 (75.4)
1.730
1.730
1.700
1.670
1.940
1.820
3.220 (81.8)
1.660 (42.2)
2.120 (53.8)
(49.3)
2.010 (51.1)
(55.6)
2.260 (57.4)
(62.0)
(62.0)
2.530 (64.3)
(68.3)
(68.3)
3.040 (77.2)
(74.4)
* Code C, MIL-C-22992, Left-Hand Thread. Connector designations depicted thus [ ] are for reference only and are not to be used in part number development.
BACKSHELL INTERFACE STANDARDS (See pages 15-17 for more information)
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1. Introduction
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PowerWorldonsemi and Avnet IoT Innovation Design Competition
Using Ti SensorTag and Android phones, the patient's/elder's physical condition can be continuously collected in real time, such as body temperature, pulse, heart rate, skin resistance and other infor...
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In mobile technology, sensors are the primary input for measured signals and form a component of a sensor system. They include sensitive and transducer elements connected to carriers and circuits. ...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
Since the beginning of this year, price wars have intensified, new models have been launched one after another, used cars with zero kilometers have become a hot topic, and the industry's internal c...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
While the current industry consensus is that autonomous vehicles are robots and that their systems are managed using robotics-developed thinking, there are also cases where autonomous driving is ac...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
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New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
The mobile computing market is rapidly evolving, and manufacturers are fiercely competing for market share. A key area of competition is battery life, which encompasses two key aspects: how long th...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
Most cameras on the market use chips manufactured by Japanese companies like Sony, Sharp, Panasonic, and LG. South Korea now has the capability to produce chips, but the quality is somewhat inferio...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
At present, the most troubling thing about pure electric vehicles as new energy sources is not only the range anxiety, but also the disadvantage of long charging time. At present, ternary lithium b...[Details]
Microcontroller MCU
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