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2220J2000473MXBE03

Description
Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.047uF, 2220,
CategoryPassive components    capacitor   
File Size413KB,2 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Environmental Compliance
Download Datasheet Parametric View All

2220J2000473MXBE03 Overview

Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.047uF, 2220,

2220J2000473MXBE03 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid927005898
package instruction, 2220
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.047 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.5 mm
JESD-609 codee3
length5.7 mm
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingBulk
positive tolerance20%
Rated (DC) voltage (URdc)200 V
seriesX2Y
size code2220
Temperature characteristic codeX7R
Temperature Coefficient-/+15ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
width5 mm
sales@syfer.co.uk
www.syfer.com
Surface mount EMI filters
X2Y Integrated Passive Components
X2Y
The Syfer X2Y Integrated Passive Component is a 3
terminal EMI chip device.
When used in balanced line applications, the
revolutionary design provides simultaneous line-to-
line and line-to-ground filtering, using a single ceramic
chip. In this way, differential and common mode
filtering are provided in one device.
For unbalanced applications, it provides ultra low ESL
(equivalent series inductance). Capable of replacing 2
or more conventional devices, it is ideal for balanced
and unbalanced lines, twisted pairs and dc motors, in
automotive, audio, sensor and other applications.
Available in sizes from 0603 to 2220, these filters can
prove invaluable in meeting stringent EMC demands.
Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC.
+44 1603 723310
+44 1603 723301
Dielectric
X7R or C0G/NP0
Typical capacitance matching
Better than 5%
Temperature rating
-55°C to 125°C
Insulation resistance
100Gohms or 1000s (whichever is the less)
Syfer Technology Limited
Electrical configuration
Multiple capacitance
Capacitance measurement
At 1000hr point
Dielectric withstand voltage
<200V 2.5 times rated Volts for 5 secs
500V 1.5 times rated Volts for 5 secs
Charging current limited to 50mA Max.
Type
Chip size
Rated
voltage
16Vdc
25Vdc
50Vdc
100Vdc
200Vdc
500Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
150pF
15nF
120pF
12nF
10pF - 100pF
150pF - 10nF
-
-
-
-
-
-
-
-
560pF - 820pF
56nF - 68nF
390pF - 470pF
18nF - 47nF
10pF - 330pF
470pF - 15nF
-
-
-
-
0603
L
W
1.6±0.2
(0.063±0.008)
0.8±0.2
(0.03±0.008)
0.5±0.15
(0.02±0.006)
0.4±0.15
(0.016±0.006)
0.25±0.15
(0.010±0.006)
E03
0603
0805
1206
1410
1812
2220
Minimum and maximum capacitance values
-
-
1.8nF - 3.3nF
-
1.2nF - 1.5nF
56nF - 220nF
22pF - 1.0nF
1.5nF - 47nF
22pF - 1.0nF
820pF - 33nF
-
-
0805
2.0±0.3
(0.08±0.012)
1.25±0.2
(0.05±0.008)
1.0±0.15
(0.04±0.006)
0.5±0.25
(0.02±0.01)
0.3±0.15
(0.012±0.006)
-
-
6.8nF - 8.2nF
470nF
4.7nF - 5.6nF
180nF - 400nF
100pF - 3.9nF
4.7nF - 150nF
100pF - 3.3nF
1.2nF - 120nF
-
-
1206
3.2±0.3
(0.126±0.012)
1.60±0.2
(0.063±0.008)
1.1±0.2
(0.043±0.008)
0.95±0.3
(0.037±0.012)
0.5±0.25
(0.02±0.01)
-
-
12nF - 15nF
820nF
8.2nF - 10nF
390nF - 680nF
820pF - 6.8nF
8.2nF - 330nF
820pF - 5.6nF
2.7nF - 180nF
820pF - 3.9nF
2.7nF - 100nF
1410
3.6±0.3
(0.14±0.012)
2.5±0.3
(0.1±0.012)
2.0 max.
(0.08 max.)
1.20±0.3
(0.047±0.012)
0.5±0.25
(0.02±0.01)
-
-
22nF - 33nF
1.2µF
18nF
560nF - 1.0µF
1.0nF - 15nF
10nF - 470nF
1.0nF - 15nF
4.7nF - 470nF
1.0nF - 10nF
4.7nF - 180nF
2220
5.7±0.4
(0.22±0.016)
5.0±0.4
(0.2±0.016)
2.5 max.
(0.1 max.)
2.25±0.4
(0.09±0.016)
0.75±0.25
(0.03±0.01)
Notes: 1) For some lower capacitance parts, higher voltage
rated parts may be supplied.
1812
4.5±0.35
(0.18±0.014)
3.2±0.3
(0.126±0.012)
2.1 max.
(0.08 max.)
1.4±0.35
(0.06±0.014)
0.75±0.25
(0.03±0.01)
L
T
B1
T
W
B2
B2
B1
Notes: 1) All dimensions mm (inches).
2) Pad widths less than chip width gives improved mechanical performance.
3) The solder stencil should place 4 discrete solder pads. The un-printed distance between
ground pads is shown as dim E.
4) Insulating the earth track underneath the filters is acceptable and can help avoid
displacement of filter during soldering
but can result in residue entrapment under the chip.
Recommended solder lands
D
B
E
A
0603
A
B
C
D
0.6 (0.024)
0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0.4 (0.016)
0805
0.95 (0.037)
0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
0.75 (0.030)
1206
1.2 (0.047)
0.9 (0.035)
0.6 (0.024)
0.8 (0.031 )
1.0 (0.039)
1410
2.05 (0.08)
1.0 (0.040)
0.7 (0.028)
0.9 (0.035)
1.85 (0.071)
1812
2.65 (0.104)
1.4 (0.055)
0.8 (0.031)
1.4 (0.055)
2.05 (0.080)
2220
4.15 (0.163)
1.4 (0.055)
1.2 (0.047)
1.8 (0.071)
3.95 (0.156)
C
E

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