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SHD285808SV

Description
Power Field-Effect Transistor,
CategoryDiscrete semiconductor    The transistor   
File Size328KB,3 Pages
ManufacturerSENSITRON
Websitehttp://www.sensitron.com/
Download Datasheet Parametric View All

SHD285808SV Overview

Power Field-Effect Transistor,

SHD285808SV Parametric

Parameter NameAttribute value
Objectid8338686146
package instruction,
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL6.12
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage200 V
Maximum drain current (ID)40 A
Maximum drain-source on-resistance0.105 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss)170 pF
JESD-30 codeR-MBCC-N3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialMETAL
Package shapeRECTANGULAR
Package formCHIP CARRIER
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)300 W
Maximum pulsed drain current (IDM)120 A
GuidelineMIL-19500
surface mountYES
Terminal formNO LEAD
Terminal locationBOTTOM
transistor applicationsSWITCHING
Transistor component materialsSILICON
Maximum off time (toff)160 ns
Maximum opening time (tons)125 ns
SENSITRON
SEMICONDUCTOR
TECHNICAL DATA
DATA SHEET 5550, Rev -
SHD285808
HERMETIC POWER MOSFET
P-CHANNEL
FEATURES:
200 Volt, 0.1 Ohm, 40A P Channel MOSFET
SMD-2 Hermetic Metal Package
Fast Switching
Low R
DS (on)
Rohs Compliant Option – For Rohs compliance, use suffix -G
MAXIMUM RATINGS
ALL RATINGS ARE AT T
C
= 25C UNLESS OTHERWISE SPECIFIED.
SYMBOL
V
GS
I
D (25)
I
DM
T
J
/T
STG
P
D
MIN.
-
-
-
-55
-
TYP.
-
-
-
-
-
MAX.
20
- 40
- 120
+150
300
UNITS
Volts
Amps
Amps
C
Watts
RATING
GATE TO SOURCE VOLTAGE
ON-STATE DRAIN CURRENT
PULSED DRAIN CURRENT
@ T
C
= 25C
OPERATING AND STORAGE TEMPERATURE
TOTAL DEVICE DISSIPATION @ T
C
= 25C
ELECTRICAL CHARACTERISTICS
DRAIN TO SOURCE BREAKDOWN VOLTAGE
V
GS
= 0V, I
D
= - 0.25mA
STATIC DRAIN TO SOURCE ON STATE RESISTANCE
V
GS
= - 10V, I
D
= 0.5I
D25
GATE THRESHOLD VOLTAGE V
DS
= V
GS
, I
D
= - 250A
FORWARD TRANSCONDUCTANCE
V
DS
= - 10V; I
D
= 0.5I
D25
ZERO GATE VOLTAGE DRAIN CURRENT
V
DS
= V
DSS
V
GS
= 0V, T
J
= 125C
GATE TO SOURCE LEAKAGE FORWARD
V
GS
= 20V
GATE TO SOURCE LEAKAGE REVERSE
V
GS
= -20V
TURN ON DELAY TIME
V
DS
= 0.5V
DSS’,
RISE TIME
I
D
= 0.5I
D25,
TURN OFF DELAY TIME
R
G
= 2,
FALL TIME
V
GS
= - 10V
DIODE FORWARD VOLTAGE
I
F
= - 24A
V
GS
= 0V
Pulse test, t
300
s,
duty cycle d
2 %
REVERSE RECOVERY TIME
REVERSE RECOVERY CHARGE
I
F
= - 24A,
V
GS
= 0V, di/dt = 100A/sec, V
R
= 100V
INPUT CAPACITANCE
V
GS
= 0 V
OUTPUT CAPACITANCE
V
DS
= - 25 V
REVERSE TRANSFER CAPACITANCE
f = 1MHz
THERMAL RESISTANCE, JUNCTION TO CASE
BV
DSS
R
DS(ON)
V
GS(th)
g
fs
- 200
-
-
Volts
Volts
S(1/)
μA
nA
-
- 2.0
-
0.09
-
22
0.105
- 4.0
-
I
DSS
I
GSS
t
d(ON)
t
r
t
d(OFF)
t
f
V
SD
t
rr
Q
rr
C
iss
C
oss
C
rss
R
thJC
-
-
-
-
-
30
46
67
27
-
260
4.2
5400
1540
170
-
-
-
- 25
- 200
100
-100
50
75
110
50
- 3.3
400
nsec
Volts
nsec
μC
-
-
pF
0.42
C/W
-
2019
Sensitron Semiconductor PH (631) 586-7600
FAX (631) 242-9798
www.sensitron.com
sales@sensitron.com
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