f = 75 MHz, Integration bandwidth = 900 kHz to 7.5 MHz.
Vdd_YY
f = 75 MHz, Integration bandwidth = 12 kHz to 20 MHz.
Vdd_YY
LVCMOS Output Characteristics
Output Low Voltage
VOL
–
–
10%
Vdd
Input Characteristics
Input High Voltage
Input Low Voltage
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
50
2
Startup Time
Enable/Disable Time
Resume Time
RMS Period Jitter
T_start
T_oe
T_resume
T_jitt
–
–
–
–
–
Peak-to-peak Period Jitter
T_pk
–
–
RMS Phase Jitter (random)
T_phj
–
–
–
–
–
–
87
–
–
–
–
1.8
–
12
14
0.5
1.3
–
–
–
30%
150
–
5
138
5
Jitter
3
3.3
25
30
0.9
2
1.4
2.3
ps
ps
ps
ps
ps
ps
ps
ps
Vdd
Vdd
k
M
ms
ns
ms
Startup and Resume Timing
Table 2. Pin Description
Pin
Symbol
Output Enable
1
OE/ST /NC
̅ ̅̅
Functionality
H
[1]
: specified frequency output
L: output is high impedance. Only output driver is disabled.
H
[1]
: specified frequency output
L: output is low (weak pull down). Device goes to sleep mode. Supply
current reduces to I_std.
Any voltage between 0 and Vdd or Open
[1]
: Specified frequency
output. Pin 1 has no function.
Electrical ground
Oscillator output
Power supply voltage
[2]
OE/ST /NC
̅ ̅̅
Top View
VDD
Standby
No Connect
2
3
4
GND
OUT
VDD
Power
Output
Power
GND
OUT
Figure 1. Pin Assignments
Notes:
1. In OE or ST mode, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If pin 1 needs to be left floating, use the NC option.
̅ ̅̅
2.
A capacitor of value 0.1 µF or higher between Vdd and GND is required.
Rev 1.07
Page 2 of 18
www.sitime.com
SiT1602B
Low Power, Standard Frequency Oscillator
Table 3. Absolute Maximum Limits
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance
of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter
Storage Temperature
Vdd
Electrostatic Discharge
Soldering Temperature (follow standard Pb free
soldering guidelines)
Junction Temperature
[3]
Note:
3. Exceeding this temperature for extended period of time may damage the device.
Min.
-65
-0.5
–
–
–
Max.
150
4
2000
260
150
Unit
°C
V
V
°C
°C
Table 4. Thermal Consideration
[4]
Package
7050
5032
3225
2520
2016
JA, 4 Layer Board
(°C/W)
142
97
109
117
152
JA, 2 Layer Board
(°C/W)
273
199
212
222
252
JC, Bottom
(°C/W)
30
24
27
26
36
Note:
4. Refer to JESD51 for
JA
and
JC
definitions, and reference layout used to determine the
JA
and
JC
values in the above table.
Table 5. Maximum Operating Junction Temperature
[5]
Max Operating Temperature (ambient)
70°C
85°C
Maximum Operating Junction Temperature
80°C
95°C
Note:
5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.
Table 6. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensitivity Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Rev 1.07
Page 3 of 18
www.sitime.com
SiT1602B
Low Power, Standard Frequency Oscillator
Test Circuit and Waveform
[6]
Vdd
Vout
Test Point
tr
80% Vdd
tf
4
Power
Supply
0.1 uF
1
3
2
15pF
(including probe
and fixture
capacitance)
50%
20% Vdd
High Pulse
(TH)
Period
Low Pulse
(TL)
Vdd
OE/ST Function
1 kΩ
Figure 2. Test Circuit
Note:
6.
Duty Cycle is computed as Duty Cycle = TH/Period.
Figure 3. Waveform
Timing Diagrams
90% Vdd
Vdd
Vdd
50% Vdd
[7]
Pin 4 Voltage
T_start
No Glitch
during start up
ST Voltage
T_resume
CLK Output
HZ
T_start: Time to start from power-off
CLK Output
HZ
T_resume: Time to resume from ST
Figure 4. Startup Timing (OE/ ST̅ Mode)
̅ ̅
Figure 5. Standby Resume Timing ( ST̅ Mode Only)
̅ ̅
Vdd
50% Vdd
OE Voltage
T_oe
Vdd
OE Voltage
50% Vdd
T_oe
CLK Output
HZ
T_oe: Time to re-enable the clock output
CLK Output
HZ
T_oe: Time to put the output in High Z mode
Figure 6. OE Enable Timing (OE Mode Only)
Note:
7.
Figure 7. OE Disable Timing (OE Mode Only)
SiT1602 has “no runt” pulses and “no glitch” output during startup or resume.
There are many MCUs below two yuan now. I provide several models. If you know, please recommend them. 1,KB Taiwan Junta 8p160, MAsk 1.00/pcs 2,Sonix 8p2501a, OTP 1.20/pcs 3,MDT 2005, OTP 1.50/pcs 4,NT...
With the development of speech recognition technology, development boards with speech recognition processing functions have gradually become more abundant. Currently, the development boards available ...
I want to start from the basics and take classes in Shanghai on weekends. The teachers are capable and have some development experience. I want to learn hardware design and the ultimate goal is to be ...
I customized the emulator SDK for eMbedded Visual C++ 4.0 and Platform Builder 5.0. After running it in evc, the emulator starts, but the folder sharing under the emulator is grayed out, and the folde...
Emergency hand-held lamps powered by 6V maintenance-free batteries are widely used in rural areas. The charger used is a transformer step-down and single diode half-wave rectifier, and the charging...[Details]
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
To differentiate their products in a crowded and competitive market, manufacturers of handheld devices often consider battery life and power management as key selling points for cell phones, PDAs, ...[Details]
July 11, 2012, Beijing - Altera Corporation (NASDAQ: ALTR) today announced the launch of 40-Gbps Ethernet (40GbE) and 100-Gbps Ethernet (100GbE) intellectual property (IP) core products. These core...[Details]
1. Introduction to CIF Board
Fieldbus integration based on PC system
Whether it is a master or a slave, fieldbus has won unanimous praise in the field of PC-based automation. For more...[Details]
In the single-chip microcomputer system, in addition to display devices, sound devices are often used, and the most common sound device is the buzzer. Buzzers are generally used for some low-demand...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
Introduction
In industrial control, speed measurement is often required. Generally, a contact tachometer is used. This tachometer must be placed against the center of the shaft to measure. It...[Details]
Every time I go home and walk up the stairs, I am always scared. The corridor lights are often broken, and no one changes the bulbs, or they are not smart enough and need to be operated manually. E...[Details]
Among the uses of electrical energy, lighting accounts for a considerable proportion. Compared with the earlier ordinary incandescent lamps, the fluorescent lamps and energy-saving lamps we commonl...[Details]
Portable power applications are broad and varied. Products range from wireless sensor nodes with average power consumption of only a few microwatts to in-vehicle medical or data acquisition systems...[Details]
Movpower is a portable power bank. It can charge most mobile phones and digital products, such as digital cameras, PDAs, and mobile phones such as Apple, iPod, Blackberry, Motorola, Samsung, Nokia,...[Details]
The most important components of new energy electric vehicles are power batteries, electric motors and energy conversion control systems. The power battery must achieve high performance such as fas...[Details]
The capacity of a battery depends on the amount of charge and discharge, in addition to some factors of the battery itself. Obviously, if the charge and discharge of the battery can be recorded all...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
