EEWORLDEEWORLDEEWORLD

Part Number

Search

DIP-1998HT-01-2291BA

Description
Array/Network Resistor, Bussed, Thin Film, 0.08W, 2290ohm, 100V, 0.01% +/-Tol, -100,100ppm/Cel, 8025,
CategoryPassive components    The resistor   
File Size503KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

DIP-1998HT-01-2291BA Overview

Array/Network Resistor, Bussed, Thin Film, 0.08W, 2290ohm, 100V, 0.01% +/-Tol, -100,100ppm/Cel, 8025,

DIP-1998HT-01-2291BA Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid792037785
Reach Compliance Codecompliant
ECCN codeEAR99
structureWelded
Lead length3.429 mm
lead spacing2.54 mm
Network TypeBussed
Number of terminals16
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package height2.667 mm
Package length20.32 mm
Package formDIP
Package width6.35 mm
Rated power dissipation(P)0.08 W
GuidelineMIL-PRF-55342
resistance2290 Ω
Resistor typeARRAY/NETWORK RESISTOR
series1900HT
size code8025
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Tolerance0.01%
Operating Voltage100 V
TaNFilm
®
High Temperature
DIP and SIP Networks
1900HT / 4700HT SERIES
·
·
·
·
·
Inherent reliability
Custom configurations available
Bonded leads not susceptible to solder reflow problems
Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
IRC Advanced Film Division
Ceramic sandwich construction with
high temperature epoxy encapsulent
Sputtered tantalum
nitride with passivation
oxide layer
Thermo-compression
bonded leads provide
exceptional reliability
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile, TaNFilm
®
DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
Package
Type
Size
Schematic
Ohmic
Range
Package
Power
Element
Power
Rated Voltage
(not to exceed
rated power)
Temperature
Range
14
DIP
16
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic G
Bussed
Schematic C
Isolated
Schematic G
Bussed
Schematic C
100Ω to 100KΩ
1.12W
1.00KΩ to 50KΩ
0.08W
100Ω to 100KΩ
1.28W
1.00KΩ to 50KΩ
-55°C to +200°C
50Ω to 50KΩ
0.24W
2.00KΩ to 25KΩ
0.08W
50Ω to 50KΩ
0.32W
2.00KΩ to 25KΩ
50V
100V
6
SIP
8
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
HT Series Issue November 2008 Sheet 1 of 3
How to solve the reset problem of MSP430
Sometimes, MSP430 cannot be reset immediately after the entire system is powered off. It is necessary to short-circuit the power supply of the entire system for a few minutes after the power is off to...
zgh836987437 Microcontroller MCU
Playing web games will shut down
The computer boots up normally and plays the game normally, but it shuts down automatically when playing web games. The power supply and graphics card are normal....
szchow Power technology
In the era of lead-free manufacturing, constant temperature soldering iron soldering stations can learn from the reservoir effect
Many expensive lead-free soldering stations like to emphasize and show off their powerful instantaneous temperature recovery capabilities. In fact, this is a bit of a nitpicking approach. Although the...
ardtek Analog electronics
Experience the whole process of replacing the screen protector for Nokia 8800
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i]...
lorant Mobile and portable
How to prevent WINCE 5.0 multi-image address space overlap?
In config.bib, the CE image is divided into 4 parts, for example: KERNEL.BIN, DRIVER.BIN, APP.BIN, NK.BIN. This is done so that a single image file can be upgraded later. Now the problem is that the a...
lance0220 Embedded System
Killed by MSP430F2013's SPI
I originally planned to use 2013 to make 16-bit AD, and then use SPI to transmit the data to 149. When I was doing it, I found that there were too few materials for 2013, especially Chinese materials....
gfgf Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2262  2011  369  108  2012  46  41  8  3  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号