Micro Edgeboard - .050" Contact Spacing
The Micro Edgeboard (MEB) connector series
provides a combination of high density and high
reliability for applications in airborne and space
systems, computers and peripherals, and
industrial /commercial control systems. This
series incorporates the proven
MICROPIN
TM
/MICROSOCKET
TM
contact. This
contact has an outstanding record of high
reliability and millions of contacts are in use in
various applications where electrical
interconnects are used.
The MEB has machined aluminum shells for
ruggedness, diallyl phthalate insulator for top
electrical performance and a 36-position
polarization key system to prevent cross plug-
MEB
ging. Contacts are on .050 (1.27) center
spacings. A variety of termination types are
available, including 90˚ or right angle pigtails
for multi-layered P.C. boards, "coke bottle”
termination for double-sided P.C. boards.
Harnessing capability is also available for both
pin and socket sides.
The MEB, including the SBR 90˚ or right angle
variation available for multi-layer boards, can
be mounted on the female (daughter) side of
double or single-sided P.C. boards. The mating
male (mother) board side can have the
terminations formed to meet the application
demands.
Conforms to MIL-C-55302/120 thru 123. (not
qualified)
Specifications
MATERIALS AND FINISHES
TERMINATION TYPES
Shell:
6061-T6 Aluminum Alloy per QQ-A-200/8 or QQ-A-225/8, electroless nickel per
Consult factory for stranded wie lead modifications codes.
SAE AMS-C-26074, Class 4, except .0010 to .0015 (0.03 to 0.04) thick or conversion
coating per MIL-C-5541, Class 3, color gold.
MECHANICAL FEATURES
Copper Alloy, 50 microinch gold per ASTM B488, Type II, Code C, Class 1.25
Contact, Pin and Socket:
Size or Length:
2 sizes
Coupling:
Friction/Jackscrew
303 stainless steel, passivated per QQ-P-35.
Jackscew/Jackpost:
r
Polarization:
Shells, polarizing keys (36 positions)
Insulator:
Glass-filled diallyl phthalate per MIL-M-14, Type SDG-F, color green Polyester
per MIL-M-24519, Type GPT-30F , color black available for MEB-128 upon
Contact Spacing Centers: .050 (1.27)
request.
Shell Styles:
Plug and receptacle
How to Order
Not applicable for printed
circuit board configurations
shown on pages 55 & 56
R
RoHS COMPLIANCE
SERIES PREFIX
CONTACT SPACING
LAYOUT
CONTACT TYPE
TERMINATION MODIFICATIONS
LEAD LENGTH
OTHER MODIFICATIONS
SERIES PREFIX
MEB -
Micro edgeboard, plug with twist pin
contacts or recept. with microsocket
contacts.
TERMINATION MODIFICATIONS
L-
Uninsulated solid wire
H-
Insulated stranded round harness
wire
S-
Solder pots
BR -
PC board right angle, socket side only
LEAD LENGTH
Consult factory for wire lead modification codes.
OTHER MODIFICATIONS
Consult factory
MEB 1 - 128 P
* * ***
CONTACT SPACING
1 - .050 (1.27) centers 128/184
2 - .100 (2.54) centers 64/92
(alternate contact holes)
LAYOUT
64, 92, 128, 184
CONTACT TYPE
P - Pin
S - Socket
* For other contact spacing acommodations consult customer service.
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
www.ittcannon.com
54
Micro Edgeboard - .050" Contact Spacing
Plug (Mother Board)
MEB1-12BS
MEB
A
.050 (1.27)
B1
B
.050
(1.27)
A1
RETAINING PIN HOLES
C
F H
#24 AWG
.250 (6.35)
E
.180 ± .005
(4.57 ± .13)
G
D
.0945 ± .0035 (2.40 ± .09) DIA.
THRU .187 (4.75) X .045 (1.14) DEEP "C" BORE 2 PLACES "A" SIDE ONLY
.187 (4.75) DIA. THRU "B"SIDE ONLY
Part No.
128S
128SBR
Weight
oz. (gm.) Max.
.5 (14.17)
.5 (14.17)
A
±.015 (0.38)
3.950 (100.33)
B
±.010 (0.25)
.250 (6.35)
C
±.010 (0.25)
.400 (10.16)
D
±.010 (0.25)
3.700 (93.98)
E
±.010 (0.25)
.300 (7.62)
F
Max.
.280 (7.11)
G*
Max.
.030 (0.76)
H
±.020 (0.51)
.200 (5.08)
*Will accept up to .093 (2.36) thick P.C. Board with shell modifications.
Receptacle (Daughter Board)
MEB1-12BS
A
.050 (1.27)
B1
B
.050
(1.27)
A1
RETAINING PIN HOLES
C
F H
#24 AWG
.250 (6.35)
E
.180 ± .005
(4.57 ± .13)
G
D
.0945 ± .0035 (2.40 ± .09) DIA.
THRU .187 (4.75) X .045 (1.14) DEEP "C" BORE 2 PLACES "A" SIDE ONLY
.187 (4.75) DIA. THRU "B"SIDE ONLY
Part No.
128S
128SBR
Weight
A
oz. (gm.) Max. ±.015 (0.38)
.5 (14.17)
3.950 (100.33)
.5 (14.17)
B
±.010 (0.25)
.250 (6.35)
C
±.010 (0.25)
.400 (10.16)
D
±.010 (0.25)
3.700 (93.98)
E
±.010 (0.25)
.300 (7.62)
F
Max.
.280 (7.11)
G*
Max.
.030 (0.76)
H
±.020 (0.51)
.200 (5.08)
*Will accept up to .093 (2.36) thick P.C. Board with shell modifications.
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
www.ittcannon.com
55
NXP MCU
京公网安备 11010802033920号
EEWORLD
