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WCR2512-8.66MFI

Description
RESISTOR, 1W, 1%, 300ppm, 8660000ohm, SURFACE MOUNT, 2512, CHIP
CategoryPassive components    The resistor   
File Size283KB,2 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

WCR2512-8.66MFI Overview

RESISTOR, 1W, 1%, 300ppm, 8660000ohm, SURFACE MOUNT, 2512, CHIP

WCR2512-8.66MFI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1768419868
package instruction, 2512
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
YTEOL7.8
JESD-609 codee3
Manufacturer's serial numberWCR
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, 7 INCH
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance8660000 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
Temperature Coefficient300 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
General Purpose Surface
Mounted Resistors
WCR Series
Welwyn Components
Excellent reliability
Wide range of sizes and ohmic values
Wrap around terminations
Inner electrode protection
Electrical Data
0201
Power rating @ 70C
Resistance range
Limiting element votage
TCR*
Resistance Tolerance
Standard values
Ambient temperature range
Zero-ohm Jumper Chip Rating
Zero-ohm Jumper Chip Resistance
watts
ohms
volts
ppm/C
%
C
amps
milliohms
0402
0603
0805
0.125
150
100
1
E24 or E96
-55 to 125
1.5
<50
1206
1210
2010
0.5
200
200
2512
1.0
0.1
0.05
0.063
10R to 1M0
25
50
250
0.25
0.25
1R0 to 10M
0.5
1
2
Physical Data
Dimensions (mm)
Style
0201
0402
0603
0805
1206
1210
2010
2512
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
L
T
C
W
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.3 ± 0.03
1.0 ± 0.05
0.35 ± 0.05
0.2 ± 0.1
0.5 ± 0.03
1.6 ± 0.15
0.5 ± 0.15
0.25 ± 0.2
0.8 ± 0.15
2.0 ± 0.2
0.5 + 0.15 -0.10
0.4 ± 0.2
1.25+ 0.2 -0.1
3.2 +0.1 -0.25 1.6 + 0.1 -0.15 0.55 +0.15 -0.1 0.5 + 0.2-0.25
3.2 + 0.1 -0.2
0.55 +0.15 -0.1
0.5 ± 0.25
2.6 ± 0.15
5.0 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
2.5 ± 0.15
6.3 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
3.2 ± 0.15
A
0.15 ± 0.05
0.25 ± 0.1
0.25 ± 0.2
0.4 ± 0.2
0.5+ 0.2 -0.25
0.5 ± 0.2
0.60 ± 0.25
0.60 ± 0.25
C
T
A
L
A
W
Wrap-around terminations
(3 faces)
Construction
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
nickel and tin plated terminations. A glazed protection coat
is applied to the resistive element (See Fig.1)
Figure 1
Tin Plating
Nickel Barrier
Dipped Conductor
Silver
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Resistance Element
Terminations
Solderability
Strength
The terminations meet the requirements of
IEC 115-1, Clause 4.17.3.2.
The terminations meet requirements of
IEC 68.2.21.
96% min Alumina Substrate
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
Iss 07.03
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
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