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5962-8552511XA

Description
Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28
Categorystorage    storage   
File Size269KB,9 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

5962-8552511XA Overview

Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28

5962-8552511XA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeDIP
package instruction0.600 INCH, CERDIP-28
Contacts28
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.211 mm
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height5.08 mm
Maximum standby current0.0008 A
Minimum standby current2 V
Maximum slew rate0.09 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width15.24 mm
Base Number Matches1

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Description Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Standard SRAM, 8KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Standard SRAM, 8KX8, 35ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 8KX8, 35ns, CMOS, PDSO28, 0.300 INCH, SOJ-28
Is it Rohs certified? incompatible incompatible incompatible conform to incompatible incompatible conform to incompatible
Parts packaging code DIP DIP DIP DIP DIP DIP DIP SOJ
package instruction 0.600 INCH, CERDIP-28 0.600 INCH, CERDIP-28 0.600 INCH, CERDIP-28 0.300 INCH, PLASTIC, DIP-28 0.600 INCH, CERDIP-28 0.600 INCH, CERDIP-28 DIP, DIP28,.3 0.300 INCH, SOJ-28
Contacts 28 28 28 28 28 28 28 28
Reach Compliance Code not_compliant _compli not_compliant unknown not_compliant not_compliant compliant not_compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C 3A001.A.2.C EAR99 EAR99
Maximum access time 70 ns 35 ns 45 ns 35 ns 55 ns 35 ns 25 ns 35 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-PDIP-T28 R-GDIP-T28 R-GDIP-T28 R-PDIP-T28 R-PDSO-J28
JESD-609 code e0 e0 e0 e3 e0 e0 e3 e0
length 37.211 mm 37.211 mm 37.211 mm 34.67 mm 37.211 mm 37.211 mm 34.67 mm 17.9324 mm
memory density 65536 bit 65536 bi 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 70 °C 125 °C 125 °C 70 °C 70 °C
Minimum operating temperature -55 °C -55 °C -55 °C - -55 °C -55 °C - -
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP DIP SOJ
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.3 DIP28,.6 DIP28,.6 DIP28,.3 SOJ28,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 225
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.08 mm 4.57 mm 5.08 mm 5.08 mm 4.57 mm 3.556 mm
Maximum standby current 0.0008 A 0.02 A 0.0008 A 0.015 A 0.0008 A 0.0002 A 0.00006 A 0.00006 A
Maximum slew rate 0.09 mA 0.16 mA 0.13 mA 0.15 mA 0.125 mA 0.14 mA 0.15 mA 0.13 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 20 20 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
width 15.24 mm 15.24 mm 15.24 mm 7.62 mm 15.24 mm 15.24 mm 7.62 mm 7.5184 mm
Base Number Matches 1 1 1 1 1 1 1 1
Is it lead-free? Contains lead Contains lead Contains lead - Contains lead Contains lead Lead free -
Maker IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Number of ports 1 1 1 - 1 1 1 -
Exportable YES YES YES - YES YES YES -
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B - 38535Q/M;38534H;883B 38535Q/M;38534H;883B - -
Minimum standby current 2 V - 2 V 4.5 V 2 V 2 V 2 V 2 V
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