EEWORLDEEWORLDEEWORLD

Part Number

Search

374724B00035

Description
Heat shrink 35mm x 35mm x 18mm adhesive mount
CategoryThermal management products   
File Size104KB,3 Pages
ManufacturerAll Sensors
Environmental Compliance
Download Datasheet Parametric View All

374724B00035 Online Shopping

Suppliers Part Number Price MOQ In stock  
374724B00035 - - View Buy Now

374724B00035 Overview

Heat shrink 35mm x 35mm x 18mm adhesive mount

374724B00035 Parametric

Parameter NameAttribute value
MakerAll Sensors
Product Categoryheat shrink
RoHSyes
Heat sink styleStraigh
Thermal resistance15.3 C / W
aim of designBGA
Standard Products Found
Page 1 of 3
TAPE Attachment Method
Part Number: 374724B00035
(Vis Number: 037807)
This part is in stock and available for immediate delivery:
Contact your
local sales rep
BGA Surface Tape Type Heat Sink Finish Part Class
Plastic
T411
Black Anodize
A
Features and Benefits
• Configurations are available for a wide range of BGA package
sizes
• Tape mounted versions eliminate the need for mounting holes
in the PC Board
• These Heat Sinks can be used with either plastic or
metal/ceramic BGA Packages depending on tape used
• These Heat Sinks are compatible with Ther-a-grip tapes
Width Length Height
Fin Thickness Fin Thickness
# of fins
# of fins
Base Thickness
Across Width Across Length
across width across length
35mm 35mm 18mm
1.4mm
1.57mm
1.5mm
10
10
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037807&attach=&size=...
2/25/2003

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1295  1204  1281  542  358  27  25  26  11  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号