Wire Bondable
Multi-tap Chip Resistors
WBC Series
•
High resistor density
•
MIL inspection available
•
Multi-tapped chip resistor
Physical Data
0.032˝ ±0.001
(0.813mm ±0.025)
Pad 13
0.032˝ ±0.001
(0.813mm ±0.025)
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
√
P x R )
Operating Temperature
Pad 1 chamfered
Noise
Substrate Material
to ±5%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
minimum)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon (gold available)
Silicon Dioxide or
Silicon Nitride
0.004˝ min Bond Pads
R
R
R
13
R
R
5R
Substrate Thickness
Aluminum
Gold
5R
5R
5R
R
T
= 40 R
Bond Pad
Metallization
Backside
5R
5R
5R
1
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
Wire Bondable
Multi-tap Chip Resistors
Power Derating Data
TCR/Inspection Code Table
Absolute TCR
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
Commercial
Code
00
01
02
03
MIL Inspection
Code*
04
05
06
07
*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection
Environmental Data
Test
Method
MIL-STD-202
Method 107
Test condition F
MIL-STD-883
Method 1008
150°C, 1000 hours
-55°C, 1000 hours
MIL-STD-202
Method 108
70°C, 1000 hours
MIL-STD-202
Method 108
125°C, 1000 hours
Max
∆R
Typical
∆R
Thermal Shock
±0.1%
±0.02%
High Temperature Exposure
±0.1%
±0.05%
Low Temperature Storage
±0.03%
±0.01%
Life
±0.5%
±0.01%
Life at Elevated Temperature
±0.5%
±0.05%
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 3
Wire Bondable
Multi-tap Chip Resistors
Manufacturing Capabilities Data
Resistance
R Total
100Ω
400Ω
800Ω
2.4KΩ
8.0KΩ
24KΩ
80KΩ
Available Absolute Tolerances
Best Absolute TCR
MK
MKJ
MKJ
MKJ
MKJ
MKJ
MKJ
±100ppm/°C
±100ppm/°C
±100ppm/°C
±50ppm/°C
±50ppm/°C
±25ppm/°C
±25ppm/°C
Ordering Data
Prefix
Style
M0303
WBC -
M0303
A
S
- 01 - 2402 -
J
Bonding pads
A = Aluminum; G = Gold
Backside
G = Gold; S = Silicon
TCR/Inspection Code
Reference TCR/Inspection Code Table
Total Resistance = R
T
4-Digit Resistance Code
Ex: 8000 = 800Ω; 2402 = 24.0KΩ
Reference manufacturing Capabilities Data Table for available resistances
Absolute Tolerance Code
M = ±20%; K = ±10%; J = ±5%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 3 of 3
京公网安备 11010802033920号
EEWORLD
