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WBC-M0303AS-01-2402-J

Description
wire bondable multi-tap chip resistors
File Size466KB,3 Pages
ManufacturerAll Sensors
Download Datasheet View All

WBC-M0303AS-01-2402-J Overview

wire bondable multi-tap chip resistors

Wire Bondable
Multi-tap Chip Resistors
WBC Series
High resistor density
MIL inspection available
Multi-tapped chip resistor
Physical Data
0.032˝ ±0.001
(0.813mm ±0.025)
Pad 13
0.032˝ ±0.001
(0.813mm ±0.025)
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Pad 1 chamfered
Noise
Substrate Material
to ±5%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
minimum)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon (gold available)
Silicon Dioxide or
Silicon Nitride
0.004˝ min Bond Pads
R
R
R
13
R
R
5R
Substrate Thickness
Aluminum
Gold
5R
5R
5R
R
T
= 40 R
Bond Pad
Metallization
Backside
5R
5R
5R
1
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
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