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5962-9461204H4X

Description
Flash Module, 512KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size1MB,12 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461204H4X Overview

Flash Module, 512KX32, 70ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

5962-9461204H4X Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codePGA
package instruction1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time70 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
JESD-609 codee4
length27.3 mm
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height4.6 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width27.3 mm
Base Number Matches1
WF512K32-XXX5
512Kx32 5V NOR FLASH MODULE (SMD 5962-94612**)
FEATURES

Access Times of 60, 70, 90, 120, 150ns

Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(H2) (Package 400).
• 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP
(Package 502)
1
• 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U)
3.5mm (0.140") high, (Package 510)
• 68 lead, 22.4mm (0.880") CQFP (G2L) 5.08mm (0.200")
high, Package (528)

100,000 Erase/Program Cycles Minimum

Sector Architecture
• 8 equal size sectors of 64KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase

Organized as 512Kx32

Commercial, Industrial and Military Temperature Ranges

5 Volt Programming
* This product is subject to change without notice.
Note 1: Package Not Recommended for New Design
For Flash programming information and waveforms refer to "Flash programming 4M5 Application
Note AN0037."
** For reference only. See table page 11

Low Power CMOS

Embedded Erase and Program Algorithms

TTL Compatible Inputs and CMOS Outputs

Built-in Decoupling Caps for Low Noise Operation

Page Program Operation and Internal Program Control
Time

Weight
WF512K32-XG2UX5 - 8 grams typical
WF512K32N-XH1X5 - 13 grams typical
WF512K32-XG4TX5
(1)
- 20 grams typical
WF512K32-XG2LX5 - 8 grams typical
FIGURE 1 – PIN CONFIGURATION FOR WF512K32N-XH1X5
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
8
8
8
8
WE1# CS1#
OE#
A0-18
512K x 8
512K x 8
512K x 8
512K x 8
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE2# CS2#
WE3# CS3#
WE4# CS4#
I/O
20
66
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2012
Rev. 14
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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