EEWORLDEEWORLDEEWORLD

Part Number

Search

4309T-101-1500BC

Description
Array/Network Resistor, Bussed, Thin Film, 1.13W, 150ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, 8808, SIP
CategoryPassive components    The resistor   
File Size198KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Related ProductsFound1parts with similar functions to 4309T-101-1500BC
Download Datasheet Parametric View All

4309T-101-1500BC Overview

Array/Network Resistor, Bussed, Thin Film, 1.13W, 150ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, 8808, SIP

4309T-101-1500BC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerBourns
package instructionSIP
Reach Compliance Code_compli
ECCN codeEAR99
structureMolded
Component power consumption0.1 W
The first element resistor150 Ω
JESD-609 codee0
Lead length3.43 mm
lead spacing2.54 mm
Manufacturer's serial number4300T
Installation featuresTHROUGH HOLE MOUNT
Network TypeBUSSED
Number of components8
Number of functions1
Number of terminals9
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height4.95 mm
Package length22.45 mm
Package shapeRECTANGULAR PACKAGE
Package formSIP
Package width2.16 mm
Rated power dissipation(P)1.13 W
Rated temperature70 °C
resistance150 Ω
Resistor typeARRAY/NETWORK RESISTOR
series4300T
size code8808
surface mountNO
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Temperature coefficient tracking5 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeFLAT
Tolerance0.1%
Operating Voltage50 V
Base Number Matches1
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.

4309T-101-1500BC Similar Products

Part Number Manufacturer Description
4309T-101-1500BCL Bourns Array/Network Resistor, Bussed, Thin Film, 1.13W, 150ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Through Hole Mount, 8808, SIP, ROHS COMPLIANT
3DES Algorithm and FPGA Design Based on State Machine/Pipeline Technology
The principle of 3DES encryption algorithm is introduced and the FPGA design and implementation of the algorithm are described in detail. The state machine and pipeline technology are used to achieve ...
lorant FPGA/CPLD
Computer room monitoring system
Shenzhen Jiachuangda Technology Co., Ltd. Changsha Branch is a "computer room maintenance master" in the domestic industry, dedicated to computer room power equipment and Environment, image centralize...
yang22546 Embedded System
[Samples] Apply for CC1200, ISO7342, MSP430FR4133
[i=s]This post was last edited by sdx474621895 on 2015-6-2 16:11[/i] 1. Select the chip you want to apply for. TI does not give you the opportunity to apply for some chips during the event. The sample...
sdx474621895 TI Technology Forum
STM32 drives stepper motor
[i=s]This post was last edited by Zoro_ on 2017-3-23 19:34[/i] [font=微软雅黑][size=2] [color=#5E7384]This content is originally created by Zoro_, a netizen on the EEWORLD forum. If you need to reprint or...
Zoro_ stm32/stm8
23 "Wanli" Raspberry Pi car - connected to Raspberry Pi without screen
I brought the Raspberry Pi home during the Spring Festival, thinking I could play with it at home, but after bringing it back I found that the interface of the monitor at home was wrong, so I couldn’t...
lb8820265 Creative Market
Differences between various MSP430 Launchpad emulators
When I was learning 430, the so-called classic entry-level 149/169 development boards cost hundreds of dollars, and even pirated emulators cost more than 200 yuan. The traditional official evaluation ...
lcofjp Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2511  1700  1342  2139  2862  51  35  28  44  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号