PRN111163300JT datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > PRN111163300JT

Preview

PRN111163300JT: DescriptionBUSSED RESISTOR NETWORK; File Size50KB，3 Pages; ManufacturerCALMIRCO; Websitehttp://www.calmicro.com/

Download Datasheet View All

PRN111163300JT Overview

BUSSED RESISTOR NETWORK

Preview

Download Datasheet

View All

CALIFORNIA MICRO DEVICES

PRN101/111

Bussed Resistor Network

Features

• Stable resistor network

• High speed termination network

• 15 or 23 terminating lines/package

• Saves board space and reduces assembly cost

Applications

• Parallel termination

• Pull up/pull down

• Digital pulse squaring

• Coding and decoding

• Telemetry

Product Description

CAMDs PRN101/111 Bussed Resistor Termination

Networks offer high integration and performance in a

miniature QSOP or SOIC package, which saves critical

board area and provides manufacturing cost and

reliability efficiencies. This part is well-suited as a

general purpose replacement for all popular MLCC

resistor chips and larger size thick film technology

packages.

Why thin film resistor networks? A terminating resistor is

used to reduce or eliminate unwanted reflections on a

transmission line or in some cases provide DC pull-up/

pull-down. It can perform this function only when its

resistance value is closely matched to the characteristic

impedance of the transmission line. The resistors used

for terminating transmission lines must be noiseless,

stable, and functional at high frequencies. Unlike thin

film-based resistor networks, conventional thick film

resistors used for this purpose are not as stable over

temperature and time, and may have functional limita-

tions when used in high frequency applications.

SCHEMATIC CONFIGURATION

16 15 14 13 12 11 10 9

Type RB:

1 2 3 4 5 6 7 8

24 23 22 21 20 19 18 17 16 15 14 13

1 2 3 4

5 6 7 8 9 10 11 12

S TA N D A R D S P E C I F I C AT I O N S

TCR

TTCR*

Operating Temperature Range

Power Rating/Resistor

Minimum Insulation Resistance

Storage Temperature

Package Power Rating

±250ppm

±5ppm

0°C to 70°C

100mW for R < 1K

Ω

25mW for R

≥

Ω

10,000 M

Ω

–65°C to +150°C

1W, max.

S TA N D A R D VA L U E S

R (

Ω

)

Isolated

330

390

680

1.1K

Code

51R0

56R0

3300

3900

6800

1001

1101

2001

R (

Ω

)

Isolated

2.2K

2.7K

4.7K

6.8K

10K

20K

47K

Code

2201

2701

4701

6801

1002

2002

4702

N O N - S TA N D A R D S P E C I F I C AT I O N S

Absolute Tolerance (R)

7/14/2000

N O N - S TA N D A R D VA L U E S

Resistance Range

10 to 47K

Ω

C1110600

±2% , ±1%

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

Recommended Resources

ISO150 function chart

Interface circuit between CMOS and PMOS a

Low frequency microphone circuit diagram

Colorful circulating decorative light circuit

Ring current alarm circuit

TDA2020 power amplifier circuit

Please help me see the following OTDR data: Name Distance Welding Point Attenuation Factor odf1-1 0.97km 0.21 0.43db/km odf1-1 1.26km 3.13 0.067db/km odf3-19 0.23km -0.089 1.412db/km odf3-19 0.95 km 0 .451 0.318db/km odf3-15 0.16 km 0.387 -1.79...; youyouha RF/Wirelessly

stm32429 board, RGB display, self-built small font library to display Chinese characters: Please guide!...; qiujiao MCU

Help with 485 enable analysis: Please help, what is the function of adding this circuit to the 485 enable? ? ? If RXD plus a NOT gate is used to control the enable, what is the difference between the two? ? ? ?...; Simonbinbin Making friends through disassembly

Does anyone have the IO interface definition of the S3C6410 development board? The project requires LVCMOS 3.3V IO: Does anyone have the IO interface definition of the S3C6410 development board? The project requires LVCMOS 3.3V IO. I looked at the one from Feiling and it seems to be TTL level. Is there any LVCMOS? ...; yanbing_90 Embedded System

The component list of the 2017 National College Student Electronic Design Competition has been officially announced. Are you ready?: [align=left][size=4][color=#0000ff]Yesterday, the list of instruments and main components for the 2017 National Undergraduate Electronic Design Competition was officially announced in advance. How are...; eric_wang Electronics Design Contest

An engineer's experience in FPGA project development: 1. Cooperate with others. Take our hardware engineers as an example. When testing, software cooperation is generally required. A task that is extremely complex for hardware may be just a few lines of ...; liumnqti FPGA/CPLD

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components