Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
FEATURES
•
Seven standard sizes
•
High capacitance per unit volume
•
Supplied in tape on reel or in bulk
case (case sizes 0402, 0603 and
0805 only)
•
For high frequency applications
•
NiSn terminations (AgPd on
request).
APPLICATIONS
•
Consumer electronics
•
Telecommunications
•
Automotive
•
Data processing.
DESCRIPTION
The capacitor consists of a
rectangular block of ceramic dielectric
in which a number of interleaved
precious metal electrodes are
contained. This structure gives rise to
a high capacitance per unit volume.
The inner electrodes are connected to
the two terminations, either by silver
palladium (AgPd) alloy in the ratio
65 : 35, or silver dipped with a barrier
layer of plated nickel and finally
covered with a layer of plated tin
(NiSn). A cross section of the
structure is shown in Fig.1.
Class 1, NP0 50/100/200/500 V
Noble Metal Electrode
QUICK REFERENCE DATA
DESCRIPTION
Rated voltage U
R
(DC)
Capacitance range (E12 series);
note 1:
50 V; note 2
100 V
200 V
500 V
Tolerance on capacitance:
C
≥
10 pF
C < 10 pF
Test voltage (DC) for 1 minute:
50 V and 100 V
200 V
500 V
Sectional specifications
Detailed specification
Climatic category (IEC 60068)
Notes
1. Other values below 10 pF and non E12 series are available on request.
2. Also applicable for applications up to 63 V.
2.5
×
U
R
3
×
U
R
2
×
U
R
IEC 60384-10, second edition 1989-04;
also based on CECC 32 100
based on CECC 32 101-801
55/125/56
±5%; ±2%
±0.5
pF;
±0.25
pF
0.47 pF to 47000 pF
10 pF to 22 nF
10 pF to 5600 pF
10 pF to 3300 pF
VALUE
50 V, 100 V, 200 V and 500 V (IEC)
terminations
,
,
,
,
electrodes
MLB457
ceramic material
Fig.1 Construction of a ceramic multilayer capacitor.
2000 Sep 11
2
FPGA/CPLD
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