TENTATIVE
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PP200T060
POW-R-PAK
200A / 600V
TM
3 phase IGBT Assembly
Description:
The Powerex POW-R-PAK is a configurable IGBT
based power assembly that may be used as a
converter, chopper, half or full bridge, or three phase
inverter for motor control, power supply, UPS or other
power conversion applications.
The power assembly is mounted on a forced air-
cooled heatsink and features state-of-the-art Powerex
F-series trench gate IGBTs with low conduction and
switching losses for high efficiency operation. The
TM
POW-R-PAK includes a low inductance laminated
bus structure, optically isolated gate drive interfaces,
isolated gate drive power supplies, and a DC-link
capacitor bank. The control board provides a
simple user interface along with built-in
protection features including overvoltage,
undervoltage lockout, overcurrent,
overtemperature, and short circuit detection.
Depending on application characteristics the
TM
POW-R-PAK is suitable for operation with DC
bus voltages up to 400VDC and switching
frequencies above 20kHz.
Schematic
TM
Features:
High performance IGBT inverter bridge
Integrated gate drive with fault monitoring
& protection
System status / troubleshooting LEDs to
verify or monitor proper operation
Isolated gate drive power supplies
Low inductance laminated bus
Output current measurement & feedback
Superior short circuit detection & shoot
through prevention
PP200T060(-)
-1-
TENTATIVE
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PP200T060
POW-R-PAK
200A / 600V
TM
3 phase IGBT Assembly
Absolute Maximum Ratings, T
j
= 25°C unless otherwise specified
General
IGBT Junction Temperature
Storage Temperature
Operating Temperature
Voltage Applied to DC terminals
Isolation Voltage, AC 1 minute, 60Hz sinusoidal
IGBT Inverter
Collector Current (T
C
= 25°C)
Peak Collector Current (T
j
< 150°C)
Emitter Current
Peak Emitter Current
Maximum Collector Dissipation (T
j
< 150°C)
Gate Drive Board
Unregulated +24V Power Supply
Regulated +15V Power Supply
PWM Signal Input Voltage
Fault Output Supply Voltage
Fault Output Current
30
18
20
30
50
Volts
Volts
Volts
Volts
mA
I
C
I
CM
I
E
I
EM
P
c
200
400
200
400
590
Amperes
Amperes
Amperes
Amperes
Watts
Symbol
T
j
T
stg
T
op
V
CC
V
iso
-40 to +150
-40 to +125
-25 to +85
400
2500
Units
°C
°C
°C
Volts
Volts
IGBT Inverter Electrical Characteristics, T
j
= 25°C unless otherwise specified
Characteristics
Collector Cutoff Current
Collector – Emitter Saturation Voltage
Emitter – Collector Voltage
Symbol
I
CES
V
CE(sat)
V
EC
t
d(on)
Inductive Load Switching Times
t
r
t
d(off)
t
f
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
DC Link Capacitance
t
rr
Q
rr
V
CC
= 300V
I
C
= 200A
V
GE
= 15V
R
G
= 3.1Ω
Test Conditions
V
CE
= V
CES
, V
GE
= 0V
I
C
= 200A, T
j
= 25°C
I
C
= 200A, T
j
= 125°C
I
E
= 200A
Min
-
-
-
-
-
-
-
-
-
-
Typ
-
1.6
1.6
-
-
-
-
-
-
3.8
18000
Max
1
2.2
-
2.6
120
100
350
250
150
-
Units
mA
Volts
Volts
Volts
ns
ns
ns
ns
ns
µC
µF
PP200T060(-)
-2-
TENTATIVE
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PP200T060
POW-R-PAK
200A / 600V
TM
3 phase IGBT Assembly
Gate Drive Board Electrical Characteristics
Characteristics
Unregulated +24V Power Supply
Regulated +15V Power Supply
PWM Input On Threshold
PWM Input Off Threshold
Output Overcurrent Trip
Overtemperature Trip
Overvoltage Trip
DC Link Voltage Feedback
Heatsink Temperature Feedback
Output Current Feedback
96
Min
20
14.4
12
Typ
24
15
15
0
300
98
460
See Figure Below
See Figure Below
See Figure Below
100
2
Max
30
18
Units
Volts
Volts
Volts
Volts
Amperes
°C
Volts
Volts
Volts
Volts
DC Link Feedback
500
120
Heatsink Temperature Feedback
500
Output Current Feedback
Heatsink Temperature (ºC)
DC Link Voltage (Volts)
400
300
200
100
0
0
1
2
3
4
5
6
7
8
9
10
Output Current (Amps)
0
1
2
3
4
5
6
7
8
9
10
100
80
60
40
20
0
400
300
200
100
0
0
1
2
3
4
5
6
7
8
9
10
Feedback Voltage (Volts)
Feedback Voltage (Volts)
Feedback Voltage (Volts)
Thermal and Mechanical Characteristics
Characteristics
IGBT Thermal Resistance, Junction to Case
FWD Thermal Resistance, Junction to Case
Contact Thermal Resistance
Heatsink Thermal Resistance
Mounting Torque, AC terminals
Mounting Torque, DC terminals
Mounting Torque, Mounting plate
Weight
Symbol
R
th(j-c)
Q
R
th(j-c)
D
R
th(c-f)
R
th(f-a)
1500 LFM airflow
Test Conditions
Per IGBT ½ module
Per FWD ½ module
-
0.045
0.040
75
130
130
21
90
150
150
Min
-
Typ
0.13
Max
0.21
0.35
-
Units
°C/W
°C/W
°C/W
°C/W
in-lb
in-lb
in-lb
lb
PP200T060(-)
-3-
TENTATIVE
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PP200T060
POW-R-PAK
200A / 600V
TM
3 phase IGBT Assembly
Gate Drive Board Interface Signal Definitions
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Notes:
1.
2.
3.
Signal Name
Shield
PWM A-
Phase A Error
1
PWM A+
PWM B-
Phase B Error
1
PWM B+
PWM C-
Phase C Error
1
PWM C+
Overtemp
1
Not Connected
DC Link Voltage
24 VDC input power
2
Description
Connected to circuit ground
0-15 V signal controlling the duty cycle of A- IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase A overcurrent or short circuit
0-15 V signal controlling the duty cycle of A+ IGBT
0-15 V signal controlling the duty cycle of B- IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase B overcurrent or short circuit
0-15 V signal controlling the duty cycle of B+ IGBT
0-15 V signal controlling the duty cycle of C- IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = Phase C overcurrent or short circuit
0-15 V signal controlling the duty cycle of C+ IGBT
Open collector output, external pull-up resistor required
LOW = No Error; Floating = heatsink overtemp
Analog voltage representation of DC link voltage
20 – 30 VDC input voltage range
20 – 30 VDC input voltage range
14.4 – 18 VDC input voltage range
14.4 – 18 VDC input voltage range
Ground reference for 15 and 24 VDC inputs
Ground reference for 15 and 24 VDC inputs
Analog voltage representation of heatsink temperature
Tied to pins 18 and 19
Analog voltage representation of phase A output current
Tied to pins 18 and 19
Analog voltage representation of phase B output current
Tied to pins 18 and 19
Analog voltage representation of phase C output current
24 VDC input power
2
15 VDC input power
2
15 VDC input power
2
GND
GND
Heatsink Temperature
GND
3
I
out
Phase A
GND
3
I
out
Phase B
GND
3
I
out
Phase C
Open collectors can be pulled up to 30 V max and sink 50mA continuous.
Do not connect a 15 VDC and 24 VDC source to the unit at the same time, use one or the other.
GND signals to be used for analog feedback signals, i.e. twisted pair with I
out
Phase A.
Gate Drive Board Interface Connector
Description
Gate Drive Board Interface Header
Recommended Mating Socket
Recommended Strain Relief
Symbol
J1
-
-
Type
0.100” x 0.100” latching header, 26 pin
0.100” x 0.100” IDC socket, 26 pin
Plastic strain relief
Manufacturer
3M# 3429-6002 or equivalent
3M# 3399-7600 or equivalent
3M# 3448-3026 or equivalent
PP200T060(-)
-4-
TENTATIVE
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
PP200T060
POW-R-PAK
200A / 600V
TM
3 phase IGBT Assembly
Performance Curves
Effective Output Current vs. Carrier Frequency (Typical)
140
130
IGBT Junction Temperature
120
110
100
90
80
70
60
50
40
40
60
80
100 120 140 160 180 200 220 240 260 280 300
I
out
A
RMS
10kHz
5kHz
1kHz
Condition
Ambient Temperature
DC Bus Voltage
Load Power Factor
IGBT Saturation Voltage
IGBT Switching Loss
Airflow
Switching Conditions
Symbol
T
A
V
CC
cos
φ
V
CE(sat)
E
SW
-
Value
40
300
0.8
Typical @ T
J
= 125°C
Typical @ T
J
= 125°C
1500
Units
°C
Volts
Volts
mJ
LFM
3 phase PWM, 60Hz sinusoidal output
PP200T060(-)
-5-
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