LD03YA8R2DAB9A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD03YA8R2DAB9A

LD03YA8R2DAB9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 16V, 6.1% +Tol, 6.1% -Tol, C0G, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 0603, CHIP; CategoryPassive components capacitor; File Size117KB，7 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD03YA8R2DAB9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 16V, 6.1% +Tol, 6.1% -Tol, C0G, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 0603, CHIP

LD03YA8R2DAB9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1862906958
package instruction	, 0603
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.0000082 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.9 mm
JESD-609 code	e0
length	1.6 mm
Manufacturer's serial number	LD03
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	6.0976%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	6.0976%
Rated (DC) voltage (URdc)	16 V
series	LD
size code	0603
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	0.81 mm

Preview

Download Datasheet

View All

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corporation will support those customers for

commercial and military Multilayer Ceramic Capacitors with

a termination consisting of 5% minimum lead. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

Not RoHS Compliant

PART NUMBER (see page 2 for complete part number explanation)

LD05

Size

LD02 - 0402

LD03 - 0603

LD04 - 0504*

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD12 - 1812

LD13 - 1825

LD14 - 2225

LD20 - 2220

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

35V = D

50V = 5

100V = 1

200V = 2

500V = 7

Dielectric

C0G (NP0) = A

X7R = C

X5R = D

X8R = F

101

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Special

Code

A = Std.

Product

Capacitance

Failure

Terminations

Packaging

Tolerance

Rate

2 = 7" Reel

B = 5% min lead

= ±.10 pF (<10pF) A = Not X = FLEXITERM

4 = 13" Reel

= ±.25 pF (<10pF) Applicable

7 = Bulk Cass.

with 5% min

= ±.50 pF (<10pF)

9 = Bulk

lead**

= ±1% (≥ 10 pF)

= ±2% (≥ 10 pF)

Contact Factory

**X7R only

= ±5%

For

= ±10%

Multiples

= ±20%

*LD04 has the same CV ranges as LD03.

NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

See FLEXITERM

section

for CV options

NP0

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 17 for Electrical Graphs

Refer to page 21 for Electrical Graphs

Refer to page 24 for Electrical Graphs

Refer to page 27 for Electrical Graphs

Recommended Resources

Thyristor trigger circuit with photoelectric isolation

5V, 1A remote control voltage regulator circuit

Snoring and sleep talking arrester circuit

Light controlled AC switch circuit

uPC1277H power amplifier circuit

555 temperature/frequency conversion circuit

STM32 development board USB circuit: I plan to design a minimum system board for STM32, and use my own development board as a reference. I don't quite understand the USB circuit of the development board, so I hope you can explain it to m...; superdianzifans stm32/stm8

My M8 learning board cannot be sold, so I would like to share the PCB with you all!: Hope it helps beginners!...; 蓝雨夜 Microchip MCU

Is there anyone who has developed RIL components (phone/sms functions----GSM/GPRS) under WINCE60? Come and exchange ideas when you have time. I am new to this area and hope to discuss more with you! ! !: Is there anyone who has developed RIL components (phone/sms functions----GSM/GPRS) under WINCE60? Come and exchange ideas when you have time. I am new to this area and hope to discuss more with you! !...; wangbaogang001 Embedded System

Embedded Development - sqlite3 cross compilation: 1. First, go to http://www.sqlite.org/download.html to download the source code of the Linux version: sqlite-autoconf-3130000.tar.gz. 2. Unzip: tar xvzf sqlite-autoconf-3130000.tar.gz 3. Enter the unz...; liuyudian Real-time operating system RTOS

Looking for STM8 mixed programming or assembly routines: Because the ROM is very tight, there is no other way, considering using mixed programming, but there is no relevant routine. I want a mixed programming routine for STM8.If there is an STM8 assembly ro...; mzoetc stm32/stm8

Good news, the fpga4fun website can be opened, everyone should try it, haha: A few days ago, I couldn't open the fpga4fun website. It was said that I had to climb over the firewall to get in. But this afternoon, I was able to get in. . Hahaha{:1_113:}...; 天明 FPGA/CPLD

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components