Product
Specification
108-40018
11Mar11 Rev F
AMP-LATCH* and IDC Header Connectors, .100 X .100 Inch Grid
1.
1.1.
SCOPE
Content
This specification covers perform ance, tests and quality requirem ents for AMP-LATCH* universal and
low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical
assem blies.
1.2.
Qualification
W hen tests are perform ed on subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be perform ed using applicable inspection plan and product drawing.
1.3.
Successful qualification testing on the subject product line was com pleted on 03Nov95, additional
testing was com pleted on 23Feb10. The Qualification Test Report num ber for this testing is 501-325.
This docum entation is on file at and available from Engineering Practices and Standards (EPS).
APPLICABLE DOCUM ENTS
The following docum ents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the docum ent applies. In the event of conflict between the
requirem ents of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirem ents of this specification and referenced docum ents, this
specification shall take precedence.
2.1.
TE Connectivity (TE) Docum ents
!
!
!
2.2.
109-1: Test Specification (General Requirem ents for Test Specifications)
109 Series: Test Specifications as indicated in Figure 1
501-325: Qualification Test Report (Connector, AMPLATCH* Header, .100 X .100 Inch Grid)
2.
Industry Docum ent
EIA-364: Electrical Connector/Socket Test Procedures Including Environm ental Classifications
2.3.
Reference Docum ent
109-197: Test Specification (Tyco Electronics Test Specifications vs EIA and IEC Test Methods)
3.
3.1.
REQUIREM ENTS
Design and Construction
Product shall be of design, construction and physical dim ensions specified on applicable product
drawing.
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
1 of 5
LOC B
108-40018
3.3.
Ratings
!
!
!
3.4.
Voltage: 250 volts AC
Current: Signal application only, 1 am pere m axim um per contact
Tem perature: -65 to 105°C
Perform ance and Test Description
Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. Unless otherwise specified, all tests shall be perform ed at am bient environm ental
conditions per Test Specification 109-1.
3.5.
Test Requirem ents and Procedures Sum m ary
Test Description
Requirem ent
Meets requirem ents of product
drawing.
ELECTRICAL
Procedure
Visual, dim ensional and functional
per applicable quality inspection
plan.
Exam ination of product.
Insulation resistance.
5000 m egohm s m inim um initial.
1000 m egohm s m inim um final.
EIA-364-21.
500 volts DC, 2 m inute hold.
Test between adjacent contacts of
unm ated specim ens.
W ithstanding voltage.
One m inute hold with no breakdown EIA-364-20, Condition I.
or flashover.
1000 volts AC at sea level.
Test between adjacent contacts of
unm ated specim ens.
MECHANICAL
Solderability.
Solderable area shall have
m inim um of 95% solder coverage.
TE Spec 109-11-1.
Subject contacts to solderability for
specim ens with tin-lead plated
soldertails.
TE Spec 109-11-11.
Subject contacts to solderability for
specim ens with lead-free tin plated
soldertails.
Com ponent resistance to wave
soldering.
See Note.
TE Spec 109-202, Condition A.
240°C for specim ens with tin-lead
plated soldertails.
TE Spec 109-202, Condition B.
265°C for specim ens with lead-free
tin plated soldertails.
Contact retention.
Post shall not dislodge from norm al EIA-364-29, Method A.
position.
Apply axial load of 2 pounds to
contacts and hold for 6 seconds.
See Figure 3.
Figure 1 (continued)
Rev F
2 of 5
108-40018
Test Description
Requirem ent
ENVIRONMENTAL
Therm al shock.
See Note.
EIA-364-32, Test Condition II.
Subject unm ated specim ens to 5
cycles between -65 and 105°C with
30 m inute dwells at tem perature
extrem es.
EIA-364-31, Method III.
Subject unm ated specim ens to 10
cycles (10 days) between 25 and
65°C at 80 to 100% RH with cold
shock.
Procedure
Hum idity/tem perature cycling.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Exam ination
1
2
3
Test Sequence (b)
Exam ination of product
Insulation resistance
W ithstanding voltage
Solderability
Com ponent resistance to wave soldering
Contact retention
Therm al shock
Hum idity/tem perature cycling
NOTE
(a)
(b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Figure 2
2
4
4
5
2
1,3,5
1,3
1,8
2,6
3,7
Rev F
3 of 5
108-40018
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Specim en Selection
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. All test groups shall each consist of a m inim um of 5
headers of each type.
B.
Test Sequence
Qualification inspection shall be verified by testing specim ens as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. W hen
product failure occurs, corrective action shall be taken and specim ens resubm itted for qualification.
Testing to confirm corrective action is required before resubm ittal.
4.4.
Quality Conform ance Inspection
The applicable quality inspection plan will specify sam pling acceptable quality level to be used.
Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing
and this specification.
Rev F
4 of 5
108-40018
AMP-LATCH Universal Header
AMP-LATCH Low Profile Header
IDC Standard Profile Header
IDC Low Profile Header
Figure 3
Contact Retention
Rev F
5 of 5
Analog electronics
京公网安备 11010802033920号
EEWORLD
