CMZ12~CMZ53
TOSHIBA Zener Diode
Silicon Diffused Type
CMZ12~CMZ53
Applications:
Communication, Control and
Measurement Equipment
Constant Voltage Regulation
Transient Suppressors
•
•
•
Average power dissipation
Zener voltage
: P = 2.0 W
: V
Z
= 12 V ~ 53 V
Unit: mm
Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Power dissipation
Junction temperature
Storage temperature range
Symbol
P
T
j
T
stg
Rating
2.0 (Note 1)
−40~150
−40~150
Unit
W
°C
°C
JEDEC
JEITA
TOSHIBA
―
―
3-4E1A
Note 1: Ta
=
30°C
Device mounted on a ceramic board
Board size: 50 mm
×
50 mm
Soldering size: 2 mm
×
2 mm
Board thickness: 0.64 t
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
2.1
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2006-11-09
CMZ12~CMZ53
Handling Precaution
1)
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend when you design a circuit with a device.
P
: We recommend that the worst case power dissipation be no greater than 50% of the
absolute maximum rating of power dissipation. Carry out adequate heat design.
P
RSM
: We recommend that a device be used within the recommended area in thefigure,
P
RSM
-tw.
T
j
: Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at a T
j
of below 120°C.
2)
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
Please refer to the Rectifiers databook for further information.
3)
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2006-11-09
CMZ12~CMZ53
Ta max – P
160
140
Device mounted on a ceramic board:
board size: 50 mm
×
50 mm
Soldering land: 2.0 mm
×
2.0 mm
board thickness: 0.64 t
P
RSM
– t
W
1000
(reference value)
PRSM
tW
Ta
=
25°C
Rectangular pulse
Maximum allowable temperature
Ta max (°C)
120
100
80
60
40
20
0
0
0.4
0.8
1.2
1.6
2
2.4
Non-repetitive peak reverse
Power dissipation PRSM (W)
Recommended
100
10
0.1
1
10
Power dissipation P
(W)
Pulse width
t
W
(ms)
α
T –
V
Z
25
CMZ12~CMZ27
(typ.)
50
CMZ30~CMZ53
α
T –
V
Z
(typ.)
Temperature coefficient of
Zener voltage
α
T (mV/°C)
Temperature coefficient of
Zener voltage
α
T (mV/°C)
20
45
15
40
10
35
5
30
0
10
14
18
22
26
25
26
30
34
38
42
46
50
54
58
Zener voltage
V
Z
(V)
Zener voltage
V
Z
(V)
r
th (j-a)
– t
1000
Device mounted on a glass-epoxy board:
Soldering land: 2.1 mm
×
1.4 mm
Transient thermal impedance
r
th (j-a)
(°C/W)
100
10
Device mounted on a glass-epoxy board:
Soldering land: 6.0 mm
×
6.0 mm
1
Device mounted on a ceramic board:
Soldering land: 2.0 mm
×
2.0 mm
0.1
0.001
0.01
0.1
1
10
100
1000
Time t (s)
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2006-11-09
CMZ12~CMZ53
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-09
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