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CMC01_06

Description
silicon diffused type for strobe discharge circuit
File Size189KB,5 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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CMC01_06 Overview

silicon diffused type for strobe discharge circuit

CMC01
TOSHIBA RECTIFIER SILICON DIFFUSED TYPE
CMC01
For Strobe Discharge Circuit
Repetitive peak reverse voltage
: VRRM = 400 V
Average forward current: I
F (AV)
= 1.0 A
Repetitive peak forward current: I
FRM
= 150 A (Refer to the Note 2)
Small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current (Note 1)
Peak one cycle surge forward current
(non-repetitive)
Repetitive peak forward current
(Note 2)
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
I
FRM
T
j
T
stg
Rating
400
1.0(Ta=47°C)
30 (50 Hz)
150
-40½150
-40½150
Unit
V
A
A
A
°C
°C
JEDEC
JEITA
Note 1: Device mounted on a glass-epoxy board
TOSHIBA
3-4E1A
board size: 50 mm
×
50 mm
soldering land: 6 mm
×6
mm
Weight: 0.023 g (typ.)
glass-epoxy board thickness 1.6t
Note 3: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Symbol
V
FM
I
RRM
Test Condition
I
FM
= 1.0 A
(Pulse
test)
V
RRM
= 400 V
(Pulse
test)
Device mounted on a ceramic board
Board size:
50 mm
×
50 mm
Soldering land: 2 mm
×
2 mm
Ceramic board thickness: 0.64t
Device mounted on a glass-epoxy
board
Board size: 50 mm
×
50 mm
Soldering land: 6 mm
×
6 mm
glass-epoxy board thickness: 1.6t
Device mounted on a glass-epoxy
board
Board size: 50 mm
×
50 mm
Soldering land: 2.1 mm
×
1.4 mm
glass-epoxy board thickness: 1.6t
R
th (j-ℓ)
Min
Typ.
0.86
Max
1.0
10
60
Unit
V
μA
Thermal resistance
R
th (j-a)
110
°C/W
180
16
°C/W
1
2006-11-06

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