Product Brief
PMB 7850
E-GOLD+ V3
GSM/GPRS Single Chip Baseband IC
E - G O L D + V 3 i s a G S M / G P R S s i n g l e c h i p
mixed signal
baseband IC. It combines the analog and digital functionality of
a cellular radio together with 2 Mbit on-chip SRAM. It is designed in
Infineon Technologies’ proven 0.18 µm 1.8 V technology. E-GOLD+ V3
perfectly meets the ever increasing demands of the GSM cellular
subscriber market for low/mid-range devices with data-enabled
terminals at low costs.
Due to its flexible interfaces E-GOLD+ V3 can be set up easily to control
a wide variety of RF architectures. In combination with the Infineon
Technologies’ SMARTi RF solution a system approach is achieved,
which results in an extremely compact implementation, very low power
consumption and cost effective system performance.
Te ch n o l o g y
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Based on proven Infineon mixed signal
0.18 µm technology
1.8 V - 3.3 V digital IOs
1.8 V internal operating voltage for digital parts
2.5 V internal operating voltage for analog parts
P-LFBGA-208 package,
12 x 12 mm, 0.65 mm ball pitch
Firmware
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Applications
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GSM/GPRS/HSCSD Mobile Phones and Data Modems
Key Features
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C166S MCU core, 52 MHz
OakDSPCore
®
, 78 MHz
2 Mbit on-chip SRAM
GPRS cipher units GEA1, GEA2
I
2
C bus interface (eg. PMB 6810)
I
2
S PCM digital audio Interface
Multimedia Card interface
2
nd
SIM card interface
Ringer support for PWM output to earpiece
2 IrDA compatible UARTs
Logic port signal arranger
General Purpose IOs
Advanced dynamic power management
External memory interface to 1.8 V and 3 V devices
Page Mode Flash interface
JTAG IEEE 1149.1 Boundary scan and debug interface
OCDS level 1 debug support
FR, HR, EFR, AMR
GPRS class 12, CS 1-4
HSCSD class 10
Echo cancellation
Noise reduction
Voice memo support
MP3 decoding support
Polyphonic Ringer support
Speech recognition support optional
Documentation/Development
a n d S u p p o r t To o l s
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Product Overview
Specification
Application Note
Evaluation Board
CD-ROM Support Package
Software
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Complete software solution ranging from layer 1
up to MMI for GSM phase 2+ incl. HSCSD, GPRS
and many additional features offered by Comneon
Java
www.infineon.com/mobilesolutions
Mobile Solutions
N e v e r
s t o p
t h i n k i n g .
Product Brief
A p p l i c a t i o n E x a m p l e G S M / G P R S Te r m i n a l
Earpiece
A
D
Speech
and Channel
Decoding
Viterbi HW
Accelerator
D
SMARTi DC+
A
A
(PMB 6258)
GSM850/900
I
Automatic
Offset
Compensation
GSM1800/1900
Equalizer
D
Ringer
OakDSPCore
®
D
GSM
Cipher Unit
Q
A
A
Car Kit
A
D
Speech
and Channel
Encoding
GMSK
Modulator
D
E-GOLD+ V3
(PMB 7850)
1
4
7
*
2
5
8
0
3
6
9
#
Realtime
Clock
GSM
Timer
Power
Management
D
A
CLK
DAT
ENA
26 MHz
AFC
Control
Logic
SAM
Fast PLL
Interfaces
IC
2
Rx/Tx
IS
JTAG
ASC
IrDA
RF Control
2
GSM850/900
GSM1800/1900
2 Mbit SRAM
GPRS
Cipher Unit
DAI
MMC
SSC
Power
Amplifier
C166S
Infineon 16-Bit Core
Display
FLASH
E-POWER
(PMB 6810)
Heading to the Future
Based on GPRS and HSCSD new excit-
ing applications will create new oppor-
tunities in mobile communications.
Infineon Technologies’ enables the
customers to benefit from such a
tremendous market opportunity.
E-GOLD+ V3 provides both, analog
functions, like analog baseband filters,
ADCs, DACs, and digital signal
processing power.
To provide the MCU/DSP capabilities,
E-GOLD+ V3 makes use of a combina-
tion of Infineon’s well proven and es-
tablished C166 architecture and an
OakDSPCore
®
.
It’s E-GOLD+ V3 solution for the highly
integrated baseband as a system-on-
chip is a result of the corporation’s
successful initiative from a mere
silicon vendor to a system solution
provider.
With its system level know-how in the
area of GSM, GPRS, EDGE, and UMTS
Infineon Technologies leads the way in
providing complete system solutions
for wireless communication offering a
complete semiconductor product range
to cover all low- to high-end terminals.
This includes Baseband ICs, RF products,
Power Management ICs, Power Amplifier,
Bluetooth
TM
modules, GPS, and
many more.
Infineon Technologies system solutions
are jointly developed with its system
integration house, Danish Wireless
Design A/S in Denmark and its wireless
software development house Comneon,
with its headquarter in
Nuremberg, Germany.
Note: OakDSPCore
®
is a registered trademark of ParthusCeva, Inc.
How to reach us:
http://www.infineon.com
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components
and shall not be considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not
limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Information
For further information on technology, delivery terms
and conditions and prices please contact your nearest
Infineon Technologies Office.
Warnings
Due to technical requirements components may contain dangerous
substances. For information on the types in question please contact
your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-
support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reason-
ably be expected to cause the failure of that life-support device or
system, or to affect the safety or effectiveness of that device or sys-
tem. Life support devices or systems are intended to be implanted
in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume
that the health of the user or other persons may be endangered.
Template: pb_tmplt.fm/4/2004-01-01
Published by Infineon Technologies AG
Ordering No. B113-H7805-G3-X-7600
Printed in Germany
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