EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K08B2D05R-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.8W, 2.05ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size1MB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342K08B2D05R-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.8W, 2.05ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

M55342K08B2D05R-W Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1464004555
package instructionCHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL5.85
Other featuresSEMI PRECISION
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.71 mm
Package length5.21 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.44 mm
method of packingWAFFLE TRAY
Rated power dissipation(P)0.8 W
Rated temperature70 °C
GuidelineMIL-PRF-55342/08
resistance2.05 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage150 V
State of the Art, Inc.
Semi-Precision Thick Film Chip Resistor
MIL-PRF-55342/08 Solderable RM2010
1Ω to 22 MΩ
1, 2, 5, 10
100, 200, 300
800 mW
150 V
-65 to 150°C
M, P, R, S, U, V, T
Noise
c
d
a
b
e
Performance
Resistance Range*
Tolerances (± %)*
TCR (± ppm/°C)*
Power Rating
Voltage Rating
Operating Range
Product Levels
40
Noise (dB)
20
0
-20
-40
125
100
75
50
25
0
0
1.0
2.0 3.0 4.0
Power (W)
5.0
ceramic board
Power Dissipation
fiber epoxy board
*see QPL55342 for part number availability
1
1k
1M
Resistance Value (Ω)
Maximum Allowable Drift
Temperature Characteristic
TCR (ppm/°C)
Thermal Shock
Power Conditioning
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Moisture Resistance
Life (Qualification)
Life (FR Level)
Resistance to Soldering Heat
Resistance to Bonding Exposure
K
±100
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
L
±200
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
M
±300
±0.5%
±0.5%
±0.5%
±0.5%
±1.0%
±0.5%
±2.0%
±2.0%
±0.25%
±0.25%
0.5
Drift (|%∆R|)
0.4
0.3
0.2
0.1
0
0
2k
Life Test
100
75
50
25
0
Temperature Rise (°C)
Power Derating
Percent Power
4k 6k
Hours
8k
10k
-10
70
150
Ambient Temperature (°C)
Part Number
M55342K08B100DS -TR
Packaging: -TR: Tape & Reel
Product Level (/1000 hrs.): M: 1%
Resistance Value and Tolerance:
Three numerals and a letter indicating
decimal, value range, and tolerance
-W: Waffle Tray
P: 0.1%
R & U: 0.01%
S & V: 0.001%
T: Space 0.001%
Ω: D: 1% G: 2% J: 5% M: 10%
kΩ: E: 1% H: 2% K: 5% N: 10%
MΩ: F: 1% T: 2% L: 5% P: 10%
Termination Material: B: Solderable (SnPb solder over nickel)
Size: 08: RM2010
Temperature Characteristic (ppm/°C): K: ±100
Performance Specification MIL-PRF-55342
L: ±200
M: ±300
Mechanical
Length (a)
Width (b)
Thickness (c)
Top Termination (d)
Bottom Termination (e)
Approximate Weight
Inches
.205(.191 - .218)
.096(.093 - .103)
.028(.015 - .033)
.021(.015 - .025)
.021(.015 - .025)
0.03180 g
Millimeters
5.21(4.85 - 5.54)
2.44(2.36 - 2.62)
0.71(0.25 - 0.84)
0.53(0.38 - 0.64)
0.53(0.38 - 0.64)
.252
Recommended
Minimum
Bond Pads
(inches)
.049
.154
.100
State of the Art, Inc.
www.resistor.com
Specifications Subject to Change Without Notice
2470 Fox Hill Road, State College, PA, USA 16803-1797
Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714
All Products Made in the USA
Copyright 2015 by State of the Art, Inc.
keil uVision simulation
Keil uVision simulation: The book says that Keil uVision has peripheral simulation such as ad/da converter EEPROM and IIC simulation. Where is it set? ? How come I have never seen it after using it fo...
laobushi Embedded System
Simple simulation using Excel
One day, a small functional circuit (reusing the pulse gap of the PWM channel for key detection) needed to be added to the product. The laboratory was magically occupied by three groups of people, so ...
PowerAnts Analog electronics
How to design and implement dual network card hot backup (dual network card redundant backup)?
Hello? Under WIN2000, Ethernet network, dual network card hot backup, that is, if one network card is broken, the other redundant network card will hot switch, and the two network cards have the same ...
zhpuffin Embedded System
Huaheng engineers talk about getting started with embedded LINUX
I think it's good, so I'm sharing it with you. This article is suitable for junior developers who have no concept or experience of embedded systems and are eager to enter the field of embedded system ...
绿茶 Linux and Android
Application of PIC16F628 controlling SPI interface
I have written articles on this topic before. Today I am going to give you a very technical article . I hope you can share your experience with me....
rain Microchip MCU
Download application written in C++ on wince (question)
I am not familiar with wince, and now I am writing a download program in c++. I hope you can give me some suggestions or some source code reference. Thank you....
yinshulong Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2767  2011  1454  2027  756  56  41  30  16  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号