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BU-61582D6-821

Description
Serial IO/Communication Controller, Hybrid, CQIP70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size389KB,48 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-61582D6-821 Overview

Serial IO/Communication Controller, Hybrid, CQIP70

BU-61582D6-821 Parametric

Parameter NameAttribute value
Objectid104632874
package instructionQIP, QUIP70B,.4/.6
Reach Compliance Codeunknown
JESD-30 codeR-XQIP-P70
Number of terminals70
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeQIP
Encapsulate equivalent codeQUIP70B,.4/.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Nominal supply voltage5 V
surface mountNO
technologyHYBRID
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch1.27 mm
Terminal locationQUAD
BU-61582
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION
ENGINE (SP’ACE) TERMINAL
FEATURES
Make sure the next
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has...
®
Radiation-Hardened to 1 MRad
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Small Ceramic Package
Available to SMD 5962-96887
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
DESCRIPTION
DDC’s BU-61582 Space Advanced Communication Engine (SP’ACE)
is a radiation hardened version of the BU-61580 ACE terminal. DDC
supplies the BU-61582 with enhanced screening for space and other
high reliability applications.
The BU-61582 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The BU-61582
maintains functional and software compatibility with the standard BU-
61580 product and is packaged in the same 1.9 square-inch package
footprint.
As an option, DDC can supply the BU-61582 with space level screen-
ing. This entails enhancements in the areas of element evaluation and
screening procedures for active and passive elements, as well as the
manufacturing and screening processes used in producing the termi-
nals.
The BU-61582 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the SP’ACE terminals pro-
vide ultimate flexibility in interfacing to a host processor and inter-
nal/external RAM.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 1998, 1999 Data Device Corporation
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