microtech GmbH electronic Teltow
Chip resistors - Made in Germany
ISO 9001:2015
ISO 14001:2015
Thick film series - Standard
Type: CDF
Sizes: 0402, 0603, 0805, 1206
Characteristics:
Chip resistors in thick film technology
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient
RoHS-conform and Halogen-free according to IEC 61249-2-21 / IPC 4101B
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after date code)
Epoxy bondable contact –K
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
H
t
0402
0603
0805
1206
0,95
1,50
1,85
2,90
1,05
1,70
2,15
3,35
0,45
0,75
1,10
1,45
0,55
0,95
1,40
1,75
0,25
0,35
0,35
0,35
0,40
0,55
0,65
0,65
0,10
0,10
0,15
0,25
0,35
0,50
0,60
0,75
0,05
0,10
0,15
0,15
0,35
0,50
0,60
0,75
T
L
W
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
.
10 T pcs. for size 0402
20 T pcs. for size 0402
Blister tape
Ordering information:
CDF
Type
-N
Contact
0603
Size
0402
0603
0805
1206
10k
1%
50ppm/K
±
TCR
50
100
K
Marking
P
Packaging
5
(optional)
R-
±
Tolerance
Value
1R
.
pcs. / Reel
(T pcs.)
CDF Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
to
.
0,5
1,0
10M
K- with
P- Card tape
Depends on
size and
(from size 0603) B- Blister tape
packaging
N- without
S- Bulk
unit
(only size 0402)
Page 1
Revision: 27-Oct-20
Catalog microtech GmbH electronic
microtech GmbH electronic Teltow
Chip resistors - Made in Germany
ISO 9001:2015
ISO 14001:2015
Thick film series - Standard
Type: CDF
Sizes: 0402, 0603, 0805, 1206
Technical data – depending on size:
Size
Nominal voltage
U
max
(V)
Load
P
70
(W)
R-Range
R-Tolerance
(± %)
TCR
(± ppm/K)
P
0402
0603
0805
1206
7)
Packaging
B
x
S
x
x
x
x
50
75
150
200
0,063
0,100
0,125
0,250
1R - 10M
1R - 10M
1R - 10M
1R - 10M
1,0
0,5 / 1,0
0,5 / 1,0
0,5 / 1,0
50 / 100
50 / 100
50 / 100
50 / 100
x
1)
x
x
x
not for contact -N
Technical data - general:
Technical data
Operating temperature range
Climatic category acc. EN 60068
Solderability acc. EN 60068-2-58
Soldering heat resistance acc. EN 60068-2-58
Long time stability
Storage 155°C / 1000h
Endurance P
70
/ 70°C / 1000h
Damp heat, steady state (56d / 40°C / 93%)
± ( 1,0% + 0,05R )
± ( 0,5% + 0,05R )
± ( 1,0% + 0,05R )
-55°C … +155°C
55 / 155 / 56
245°C 3s
±( 0,5% + 0,05R ) at 260°C 10s
Data, unless specified, acc. EN 140401-802.
Page 2
Revision: 27-Oct-20
Catalog microtech GmbH electronic
NXP MCU
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