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2007-S1-12-50-640

Description
Card Edge Connector
CategoryThe connector    The connector   
File Size145KB,2 Pages
ManufacturerECS
Websitehttp://www.ecsxtal.com/
Download Datasheet Parametric View All

2007-S1-12-50-640 Overview

Card Edge Connector

2007-S1-12-50-640 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1325998782
Reach Compliance Codeunknown
ECCN codeEAR99
Connector typeCARD EDGE CONNECTOR
Contact to complete cooperationGOLD (15) OVER NICKEL (50)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialPHOSPHOR BRONZE
JESD-609 codee4
CC
S
.125” X .250” Contact Spacing, Switching Contacts
Features
• Flat Plate Installation eliminates the need for
secondary operation tooling which can damage
the connector.
• Extra large chamfered entry
• Conforms to Bell-core spec TR-TSY-00078
• Extended card scoops available
• Replaceable contacts
• Molded in polarization available between
contact, or on contact position.
• De-population of contacts per
customer specification.
• Available in selective gold plate at contact point
• Many other custom options available, including,
but not limited to:
• Single or Both Ends Open
• Selectively Loaded with Standard Signal Contacts
2000 Series Card Edge Connector
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
3 amp at 30°C
Contact Resistance:
Contact to Daughter Card:
10 m
W
max.
Compliant section to P.T.H.:
2 m
W
max.
Insulation Resistance:
5000 M
W
min.
Dielectric Withstand Voltage:
1500 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick
gage.
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick
gage.
Compliant Section Insertion Force:
40 lbs max per contact
Compliant Section Withdrawal Force:
10 lbs min. per contact
Recommended Board Thickness:
.093”+
Recommended PCB Layout Page A-33
Operating Temperature:
-54
B
C to +125
B
C
Recommended Hole Size
.040 ±.003 [1.02]
.0453 ±.001 [1.15]
.0040 [.10] min.
.0003 [.008] min.
R
C
R
Dimensions are in inch [mm]
Drilled Hole
Diameter
Plating
Thickness
.001-.003 [.03-.08]
.0003 [.008]min.
.001-.003 [.03-.08]
Hole
Diameter
Pad
Diameter
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
.0453±.001
[1.15]
Copper
Tin / Lead
After Plating
.040±.003
[1.02]
.065 [1.65]
NO. OF POS. / CONTACTS
06/12
10/20
12/24
16/32
18/36
20/40
22/44
25/50
28/56
30/60
36/72
38/76
40/80
43/86
50/100
51/102
56/112
60/120
A
1.011 [25.68]
1.511 [38.38]
1.761 [44.73]
2.261 [57.43]
2.511 [63.78]
2.761 [70.13]
3.011 [76.48]
3.386 [86.00]
3.761 [95.53]
4.011 [101.88]
4.761 [120.93]
5.011 [127.28]
5.261 [133.63]
5.626 [143.15]
6.511 [165.38]
6.636 [168.55]
7.261 [184.43]
7.761 [197.13]
B
0.875 [22.23]
1.375 [34.93]
1.625 [41.28]
2.125 [53.98]
2.375 [60.33]
2.625 [66.68]
2.875 [73.03]
3.250 [82.55]
3.625 [92.08]
3.875 [98.43]
4.625 [117.48]
4.875 [123.83]
5.125 [130.18]
5.500 [139.70]
6.375 [161.93]
6.500 [165.10]
7.125 [180.98]
7.625 [193.68]
C
0.625 [15.88]
1.125 [28.58]
1.375 [34.93]
1.875 [47.63]
2.125 [53.98]
2.375 [60.33]
2.625 [66.68]
3.000 [76.20]
3.375 [85.73]
3.625 [92.08]
4.375 [111.13]
4.625 [117.48]
4.875 [123.83]
5.250 [133.35]
6.125 [155.58]
6.250 [158.75]
6.875 [174.63]
7.375 [187.33]
For reference only, can go 1 through 60 positions.
Dimensions are in inch [mm]
WWW.ECSCONN.COM
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