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3031-S1-12-50-640

Description
Card Edge Connector
CategoryThe connector    The connector   
File Size208KB,2 Pages
ManufacturerECS
Websitehttp://www.ecsxtal.com/
Download Datasheet Parametric View All

3031-S1-12-50-640 Overview

Card Edge Connector

3031-S1-12-50-640 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1326000792
Reach Compliance Codeunknown
ECCN codeEAR99
Connector typeCARD EDGE CONNECTOR
Contact to complete cooperationGOLD (15) OVER NICKEL (50)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialPHOSPHOR BRONZE
JESD-609 codee4
CC
S
.156” X .200” Contact Spacing, Switching Contact
Features
• Flat Plate Installation eliminates the need for
secondary operation tooling which can damage
the connector.
• Extra large chamfered entry
• Conforms to Bell-core spec TR-TSY-00078
• Extended card scoops available
• Replaceable contacts
• Molded in polarization available between
contact, or on contact position.
• De-population of contacts per
customer specification.
• Available in selective gold plate at contact point
• Many other custom options available, including,
but not limited to:
• Single or Both Ends Open
• Selectively Loaded with Standard Signal Contacts
3000 Series Card Edge Connector
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
5 amps at 30°C
Contact Resistance:
Contact to Daughter Card:
10 m
W
max.
Compliant section to P.T.H.:
2 m
W
max.
Insulation Resistance:
5000 M
W
min.
Dielectric Withstand Voltage:
1800 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick
gage.
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick
gage.
Compliant Section Insertion Force:
40 lbs max per contact
Compliant Section Withdrawal Force:
10 lbs min. per contact
Recommended Board Thickness:
.093”+
Recommended PCB Layout Page A-33
Operating Temperature:
-54
B
C to +125
B
C
Recommended Hole Size
.040 ±.003 [1.02]
.0453 ±.001 [1.15]
.0040 [.10] min.
.0003 [.008] min.
R
C
R
Dimensions are in inch [mm]
Drilled Hole
Diameter
Plating
Thickness
.001-.003 [.03-.08]
.0003 [.008]min.
.001-.003 [.03-.08]
Hole
Diameter
Pad
Diameter
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
.0453±.001
[1.15]
Copper
Tin / Lead
After Plating
.040±.003
[1.02]
.065 [1.65]
NO. OF POS./CONTACTS
06/12
10/20
12/24
15/30
18/36
20/40
22/44
25/50
28/56
30/60
31/62
35/70
36/72
40/80
43/86
A
1.228 [31.19]
1.852 [47.04]
2.164 [54.97]
2.632 [66.85]
3.100 [78.74]
3.412 [86.67]
3.724 [94.59]
4.192 [106.48]
4.660 [118.36]
4.972 [126.29]
5.128 [130.25]
5.752 [146.10]
5.908 [150.06]
6.532 [165.91]
7.000 [177.80]
B
1.092 [27.74]
1.716 [43.59]
2.028 [51.51]
2.496 [63.40]
2.964 [75.29]
3.276 [83.21]
3.588 [91.14]
4.056 [103.02]
4.524 [114.91]
4.836 [122.83]
4.992 [126.80]
5.616 [142.65]
5.772 [146.61]
6.396 [162.46]
6.864 [174.35]
C
0.780 [19.81]
1.404 [35.66]
1.716 [43.59]
2.184 [55.47]
2.652 [67.36]
2.964 [75.29]
3.276 [83.21]
3.744 [95.10]
4.212 [106.99]
4.524 [114.91]
4.680 [118.87]
5.304 [137.72]
5.460 [138.68]
6.084 [154.53]
6.552 [166.42]
For reference only, can go 1 through 43 positions.
Dimensions are in inch [mm]
WWW.ECSCONN.COM
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