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DIMENSIONS
VERTICAL COMPRESSION (Z-AXIS),
OPEN PIN FIELD
A high density, open field, vertically compressed
connector utilizing a patented z-axis contact
system configured for between board (board to
board) compression applications.
Contact Spacing: .050” (1.27mm)
CONTACT CUSTOMER SERVICE
ORDER FORM
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CODE
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Sample Part Number Format: RZ250-320-115-1000
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CODE
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RZ
SERIES
HEIGHT
Vertical
100 - .100”
(Z-Axis)
150 - .150”
Compression
200 - .200”
Multi-row
250 - .250”
.050” Spacing 300 - .300”
Open Field
350 - .350”
COLUMNS
10 - 10 Column
15 - 15 Column
20 - 20 Column
25 - 25 Column
PLATING
3 - 30µin. Au
5 - 50µin. Au
CONTACT
11 - Double
Cmprsn.
20 - Future
30 - Future
TYPE
00 - No
Polarization
HARDWARE
10 - Ø.090”
Thru Hole
20 - Ø.090”
Guide Pin
VARIATION
Blank - None
XXX - Consult
Factory
ROWS
2 - 2 Row
3 - 3 Row
4 - 4 Row
5 - 5 Row
6 - 6 Row
7 - 7 Row
MATED HEIGHT
Mated height is defined as the space between the hardware clamping surfaces
(top hardware surface to bottom hardware surface). See Table 1.
MATERIALS & FINISHES
Contact:. . . . . . . .
Contact Finish: . .
Molded Insulator:
Hardware: . . . . . .
.
.
.
.
.
.
.
.
. . . . . . . . . BeCu C17200 per ASTM B 194 (Brush Alloy 190)
. . Gold per ASTM B 488 over Nickel per SAE AMS-QQ-N-290
. . Glass filled polyphenylene sulfide (PPS) per MIL-M-24519
.Stainless steel per ASTM A 582/582M, Passivated per SAE
AMS 2700
NOTE: AirBorn can manufacture special configurations for your exact specifications
PERFORMANCE
SI DATA - Differential 100 Ohm
1
2
3
4
Diff. Insertion Loss
Diff. Return Loss
NEXT
FEXT
REQUIREMENTS
ACTUAL
3.0 gHZ @ -3 dB
1.0 Ghz @ -20 dB
2.0 Ghz @ -50 dB
2.0 Ghz @ -48 dB
Contact Compression: . . . . . . . . . . . . . . . . 10 milliinches per side (nominal), for
.100” and .150” connector heights
15 milliinches per side (nominal), for .200”,
.250”, .300” and .350” connector heights
Compression Force: . . . . . . . . .≈60 grams (2.1 oz.) per contact at full deflection
Contact Wipe: . . . . . . . . . . .≈7 milliinches for .100” and .150” connector heights
≈14 milliinches for .200”, .250”, .300” and .350” connector heights
Current Rating: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 Amperes
Contact Resistance: . . . . . . . . . 25 milliohms typical (contact height dependent)
Operating Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65° C to +125° C
Insulation Resistance: . . . . . . . . . . . . . . . 5,000 megaohms minimum @ 100 VDC
Durability: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 connector mating cycles
Dielectric Withstanding: . . . . . . . . . . . . 250 VDC @ sea level, 100 VDC @ altitude
NOTE: Performance values are estimates at this time. Actual values will be
determined when final product testing is completed
PATENT PENDING
www.AIRBORN.com
(512 ) 863-5585
PRELIMINARY RELEASE
2012-Jan-30
NXP MCU
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