Flash, 16MX8, PBGA24, TFBGA-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Objectid | 8276857879 |
| package instruction | TBGA, |
| Reach Compliance Code | compliant |
| Country Of Origin | Mainland China, Taiwan |
| ECCN code | EAR99 |
| YTEOL | 5.9 |
| Other features | ALSO OPERATES WITH 133MHZ @ 1.65VMIN SUPPLY |
| Spare memory width | 1 |
| Maximum clock frequency (fCLK) | 166 MHz |
| Data retention time - minimum | 20 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PBGA-B24 |
| length | 8 mm |
| memory density | 134217728 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 16777216 words |
| character code | 16000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 16MX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TBGA |
| Encapsulate equivalent code | BGA24,4X6,40 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| Programming voltage | 1.8 V |
| Filter level | AEC-Q100 |
| Maximum seat height | 1.2 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.000075 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| type | NOR TYPE |
| width | 6 mm |
| write protect | HARDWARE/SOFTWARE |
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