R76UR2270SE30H datasheet, PDF - EEWORLD Datasheet

R76UR2270SE30H: DescriptionFilm Capacitor, Polypropylene, 2000V, 2.5% +Tol, 2.5% -Tol, 0.027uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT; CategoryPassive components capacitor; File Size3MB，32 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com; Environmental Compliance

Download Datasheet Parametric View All

R76UR2270SE30H Overview

Film Capacitor, Polypropylene, 2000V, 2.5% +Tol, 2.5% -Tol, 0.027uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	2135623585
package instruction	,
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	7.25
Other features	ESR IS MEASURED AT 100KHZ, RIPPLE CURRENT IS MEASURED AT 100KHZ AND 85CEL
capacitance	0.027 µF
Capacitor type	FILM CAPACITOR
dielectric materials	POLYPROPYLENE
ESR	29 mΩ
high	17 mm
length	32 mm
Installation features	THROUGH HOLE MOUNT
negative tolerance	2.5%
Number of terminals	2
Maximum operating temperature	110 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	Radial
method of packing	Tray
positive tolerance	2.5%
Rated (AC) voltage (URac)	700 V
Rated (DC) voltage (URdc)	2000 V
ripple current	4400 mA
surface mount	NO
Temperature Coefficient	-200+/-100ppm/Cel ppm/°C
Terminal pitch	27.5 mm
Terminal shape	WIRE
width	9 mm

Mentor Online Seminar | Let PCB engineers become "manufacturing experts" and quickly improve the secret of product yield!: Have you ever encountered this question: "If you are asked to choose between production efficiency and product quality, which one would you choose?" The reality is that we are often asked to prioritiz...; eric_wang PCB Design

I just received a project to develop a Vxwork IO driver. There are a few things I don't quite understand. I would be grateful if someone could explain it to me.: I have been working on Linux drivers and a little bit on Vxwork, but I have never understood IO drivers. Recently, I took over the development of a Japanese XXX (I didn’t remember the name...) chip, w...; xjc9837 Embedded System

[Theme Month] What is the difference between the principles of amplifying sound in a radio station speaker and a speaker made of tinplate?: [size=5][font=helvetica, Arial, "][color=#000000][b]What is the difference between the loudspeakers used in radio stations and the simple conical loudspeakers made of tinplate in achieving sound ampli...; tiankai001 Power technology

Does LM3S8962 support gdb debugging and development under Linux?: Has anyone used it? It is the LM3S8962 development board....; mybays Microcontroller MCU

[Experts come in] C# calls vs2005 vc++ smart device dll written problems: vc++'s "MFCDes.dll" exports the function __declspec (dllexport) bool DesGo(char *Out,char *In,long datalen,const char *Key,int keylen,bool Type = 0) and calls it in c# DllImport("MFCDes.dll", SetLastE...; hututu Embedded System

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components