K4S280432K
K4S280832K
K4S281632K
Synchronous DRAM
128Mb K-die SDRAM Specification
54 TSOP-II with Lead-Free & Halogen-Free
(RoHS compliant)
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AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
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2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or
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* Samsung Electronics reserves the right to change products or specification without notice.
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K4S280832K
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Table of Contents
Synchronous DRAM
1.0 FEATURES .................................................................................................................................... 4
2.0 GENERAL DESCRIPTION ............................................................................................................ 4
3.0 Ordering Information ................................................................................................................... 4
4.0 Package Physical Dimension ..................................................................................................... 5
5.0 FUNCTIONAL BLOCK DIAGRAM ................................................................................................ 6
6.0 PIN CONFIGURATION (Top view) ............................................................................................. 7
7.0 PIN FUNCTION DESCRIPTION .................................................................................................... 7
8.0 ABSOLUTE MAXIMUM RATINGS ............................................................................................... 8
9.0 DC OPERATING CONDITIONS .................................................................................................... 8
10.0 CAPACITANCE ........................................................................................................................... 8
11.0 DC CHARACTERISTICS (x4, x8) ............................................................................................... 9
12.0 DC CHARACTERISTICS (x16) ................................................................................................. 10
13.0 AC OPERATING TEST CONDITIONS ...................................................................................... 11
14.0 OPERATING AC PARAMETER ................................................................................................ 11
15.0 AC CHARACTERISTICS .......................................................................................................... 12
16.0 DQ BUFFER OUTPUT DRIVE CHARACTERISTICS ............................................................... 12
17.0 IBIS SPECIFICATION ............................................................................................................... 13
18.0 SIMPLIFIED TRUTH TABLE ..................................................................................................... 15
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Rev. 1.21 March 2008
K4S280432K
K4S280832K
K4S281632K
Synchronous DRAM
Year
2007
2007
2008
2008
- Release revision 1.0 SPEC
- Revised typo of package dimension
- Added the comment of Halogen-Free supporting
- Added -50 bin(200MHz) DRAM
- Added Package pin out lead width
History
Revision History
Revision
1.0
1.1
1.2
1.21
Month
February
November
February
March
3 of 15
Rev. 1.21 March 2008
K4S280432K
K4S280832K
K4S281632K
Synchronous DRAM
8M x 4Bit x 4 / 4M x 8Bit x 4 Banks / 2M x 16Bit x 4 Banks SDRAM
1.0 FEATURES
JEDEC standard 3.3V power supply
LVTTL compatible with multiplexed address
Four banks operation
MRS cycle with address key programs
-. CAS latency (2 & 3)
-. Burst length (1, 2, 4, 8 & Full page)
-. Burst type (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the system clock.
• Burst read single-bit write operation
• DQM (x8) & L(U)DQM (x16) for masking
• Auto & self refresh
• 64ms refresh period (4K Cycle)
• 54pin TSOP II
Lead-Free and Halogen-Free
package
•
RoHS compliant
•
•
•
•
2.0 GENERAL DESCRIPTION
The K4S280432K / K4S280832K / K4S281632K is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x
2,097,152 words by 4 bits / 4 x 4,194,304 words by 8 bits / 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG′s high perfor-
mance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible
on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to
be useful for a variety of high bandwidth, high performance memory system applications.
3.0 Ordering Information
Part No.
K4S280432K-U
*1
C/L75
K4S280832K-UC/L75
K4S281632K-UC/L50
K4S281632K-UC/L60
K4S281632K-UC/L75
Orgainization
32Mb x 4
16Mb x 8
8Mb x 16
8Mb x 16
8Mb x 16
Max Freq.
133MHz (CL=3)
133MHz (CL=3)
200MHz(CL=3)
166MHz (CL=3)
133MHz (CL=3)
LVTTL
54pin TSOP(II)
Lead-Free & Halogen-Free
*1
Interface
Package
Note 1 : 128Mb K-die SDR DRAMs support Lead-Free & Halogen-Free package with Lead-Free package code(-U).
Organization
16Mx8
8Mx16
Row Address
A0~A11
A0~A11
Column Address
A0-A9
A0-A8
Row & Column address configuration
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4.0 Package Physical Dimension
(0.80)
Synchronous DRAM
(0.50)
#54
#28
Unit : mm
10.16
±
0.10
(1.50)
(0.80)
0.665
±
0.05
0.210
±
0.05
1.00
±
0.10
22.22
±
0.10
(R
0.1
5)
(10°)
1.20 MAX
0.125
- 0.035
+0.075
(0.50)
#1
(1.50)
#27
(10°)
(10°)
11.76
±
0.20
(10.76)
0.05 MIN
0.
15
)
(0.71)
0.80TYP
[0.80
±
0.08]
(R
0.075 MAX
0.
25
)
(R
(R
0.
25
)
Detail A
Detail B
NOTE
1. ( ) IS REFERENCE
2. [ ] IS ASS’Y OUT QUALITY
Detail A
0.30
- 0.05
+0.10
Detail B
(0°
∼
8°)
0.35
- 0.05
+0.10
54Pin TSOP(II) Package Dimension
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[
(10°)
[
(4°)
0.10 MAX
Rev. 1.21 March 2008
0.45 ~ 0.75
0.25TYP