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D55342H07B261EP-W

Description
Fixed Resistor, Thin Film, 0.25W, 261000ohm, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size1MB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

D55342H07B261EP-W Overview

Fixed Resistor, Thin Film, 0.25W, 261000ohm, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP

D55342H07B261EP-W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid7024325361
package instructionCHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL5.81
Other featuresPRECISION
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingWAFFLE TRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342/07
resistance261000 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage100 V
State of the Art, Inc.
Precision Thin Film Chip Resistor
MIL-PRF-55342/07 Solderable RM1206
5.6Ω to 1.5 MΩ
0.1, 0.25, 0.5, 1, 2, 5, 10
25, 50, 100
250 mW
100 V
-65 to 150°C
M, P, R, S, U, V, T
Noise
c
d
a
b
e
Performance
Resistance Range*
Tolerances (± %)*
TCR (± ppm/°C)*
Power Rating
Voltage Rating
Operating Range
Product Levels
0
Noise (dB)
-10
-20
-30
-40
125
100
75
50
25
0
0
0.5
ceramic board
1.0 1.5 2.0
Power (W)
2.5
Power Dissipation
fiber epoxy board
*see QPL55342 for part number availability
1
1k
1M
Resistance Value (Ω)
Maximum Allowable Drift
Temperature Characteristic
TCR (ppm/°C)
Thermal Shock
Power Conditioning
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Moisture Resistance
Life (Qualification)
Life (FR Level)
Resistance to Soldering Heat
Resistance to Bonding Exposure
E
±25
±0.1%
±0.2%
±0.1%
±0.1%
±0.1%
±0.2%
±0.5%
±2.0%
±0.2%
±0.2%
H
±50
±0.25%
±0.25%
±0.25%
±0.1%
±0.2%
±0.4%
±0.5%
±2.0%
±0.25%
±0.25%
K
±100
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
0.5
Drift (|%∆R|)
0.4
0.3
0.2
0.1
0
0
2k
Life Test
Percent Power
100
75
50
25
0
Temperature Rise (°C)
Power Derating
4k 6k
Hours
8k
10k
-10
70
150
Ambient Temperature (°C)
Part Number
D55342E07B100AS -TR
Packaging: -TR: Tape & Reel
Product Level (/1000 hrs.): M: 1%
Resistance Value and Tolerance:
Three numerals and a letter indicating
decimal, value range, and tolerance
-W: Waffle Tray
P: 0.1%
R & U: 0.01%
S & V: 0.001%
T: Space 0.001%
Ω: A: 0.1% R: 0.25% W: 0.5% D: 1% G: 2% J: 5% M: 10%
kΩ: B: 0.1% U: 0.25% Y: 0.5% E: 1% H: 2% K: 5% N: 10%
MΩ: C: 0.1% V: 0.25% Z: 0.5% F: 1% T: 2% L: 5% P: 10%
Termination Material: B: Solderable (SnPb solder over nickel)
Size: 07: RM1206
Temperature Characteristic (ppm/°C): E: ±25
Performance Specification MIL-PRF-55342
H: ±50
K: ±100
Mechanical
Length (a)
Width (b)
Thickness (c)
Top Termination (d)
Bottom Termination (e)
Approximate Weight
Inches
.126(.118 - .134)
.061(.058 - .068)
.018(.015 - .033)
.015(.010 - .025)
.021(.015 - .025)
0.00840 g
Millimeters
3.20(3.00 - 3.40)
1.55(1.47 - 1.73)
0.46(0.38 - 0.84)
0.38(0.25 - 0.64)
0.53(0.25 - 0.64)
.156
Recommended
Minimum
Bond Pads
(inches)
.039
.079
.067
State of the Art, Inc.
www.resistor.com
Specifications Subject to Change Without Notice
2470 Fox Hill Road, State College, PA, USA 16803-1797
Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714
All Products Made in the USA
Copyright 2016 by State of the Art, Inc.
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