DPS512X32MFH3-30M datasheet, PDF

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DPS512X32MFH3-30M: DescriptionSRAM Module, 512KX32, 30ns, CMOS, GULLWING, STACK, SLCC-68; Categorystorage storage; File Size812KB，8 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS512X32MFH3-30M Overview

SRAM Module, 512KX32, 30ns, CMOS, GULLWING, STACK, SLCC-68

DPS512X32MFH3-30M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	B&B Electronics Manufacturing Company
Parts packaging code	QMA
package instruction	QFP, QFP68,.74X1.1,40
Contacts	68
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	30 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	R-XQMA-G68
JESD-609 code	e0
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,.74X1.1,40
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0072 A
Minimum standby current	2 V
Maximum slew rate	0.72 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	QUAD
Base Number Matches	1

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2Mx8/1Mx16/5Mx32, 20 - 45ns, STACK

30A154-04

16 Megabit High Speed CMOS SRAM

DPS512X32MFn3

DESCRIPTION:

The DPS512X32MFn3 High Speed SRAM ‘’STACK’’ modules are a

revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Available in straight leaded, ‘’J’’ leaded or gullwing leaded

packages. The module packs 16-Megabits of low-power CMOS

static RAM in an area as small as 0.549 in

, while maintaining a

total height as low as 0.269 inches.

The DPS512X32MFn3 STACK modules contain four individual

512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,

making the modules suitable for commercial, industrial and military

applications.

By using SLCCs, the ‘’Stack’’ family of modules offer a higher board

density of memory than available with conventional through-hole,

surface mount or hybrid techniques.

SLCC Stack

Straight

Leaded

Stack

FEATURES:

•

Organizations Available:

•

512K x 32, 1Meg x 16 or 2 Meg x 8

Access Times: 20*, 25, 30, 35, 45ns

Fully Static Operation

- No clock or refresh required

Single +5V Power Supply,

10% Tolerance

TTL Compatible

Common Data Inputs and Outputs

Low Data Retention Voltage:

2.0V min.

Packages Available:

SLCC Stack

Straight Leaded Stack

‘’J’’ Leaded Stack

Gullwing Leaded Stack

‘’J’’ Leaded

Stack

Gullwing

Leaded

Stack

Commercial and Industrial Grade only.

FUNCTIONAL BLOCK DIAGRAM

PIN NAMES

A0 - A18

I/O0 - I/O31

CE0 - CE3

N.C.

Address Inputs

Data Input/Output

Low Chip Enables

Write Enable

Output Enable

Power (+5V)

Ground

No Connect

30A154-04

REV. B

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right

to change products or specifications herein without prior notice.

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