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3D3D4G04WB2358-CN-H8

Description
DDR DRAM, 1GX4, CMOS, PBGA78,
Categorystorage    storage   
File Size93KB,2 Pages
Manufacturer3D PLUS
Environmental Compliance
Download Datasheet Parametric View All

3D3D4G04WB2358-CN-H8 Overview

DDR DRAM, 1GX4, CMOS, PBGA78,

3D3D4G04WB2358-CN-H8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid113247303
package instructionFBGA, BGA78,9X13,32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)667 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B78
memory density4294967296 bit
Memory IC TypeDDR DRAM
memory width4
Number of terminals78
word count1073741824 words
character code1000000000
Maximum operating temperature70 °C
Minimum operating temperature
organize1GX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA78,9X13,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
power supply1.5 V
Certification statusNot Qualified
refresh cycle8192
Maximum standby current0.024 A
Maximum slew rate0.112 mA
Nominal supply voltage (Vsup)1.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
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