D8755A-2 datasheet, PDF - EEWORLD Datasheet

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D8755A-2: DescriptionParallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，11 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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D8755A-2 Overview

Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40

D8755A-2 Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-GDIP-T40
length	52.325 mm
Number of I/O lines	16
Number of ports	2
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.72 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches	1

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REI Datasheet

8755A

16,384-Bit EPROM with I/O

The Intel 8755A is an erasable and electrically reprogrammable ROM (EPROM) and I/O chip to be

used in the 8085AH microprocessor systems. The EPROM portion is organized as 2048 words by 8

bits. It has a maximum access time of 450 ns to permit use with no wait states in an 8085AH CPU.

The I/O portion consists of 2 general purpose I/O ports. Each I/O port has 8 port lines, and each I/O

port line is individually programmable as input or output.

Rochester Electronics

Manufactured Components

Rochester branded components are

manufactured using either die/wafers

purchased from the original suppliers

or Rochester wafers recreated from the

original IP. All recreations are done with

the approval of the OCM.

Parts are tested using original factory

test programs or Rochester developed

test solutions to guarantee product

meets or exceeds the OCM data sheet.

Quality Overview

•

ISO-9001

AS9120 certification

Qualified Manufacturers List (QML) MIL-PRF-38535

•

Class Q Military

•

Class V Space Level

Qualified Suppliers List of Distributors (QSLD)

•

Rochester is a critical supplier to DLA and

meets all industry and DLA standards.

Rochester Electronics, LLC is committed to supplying

products that satisfy customer expectations for

quality and are equal to those originally supplied by

industry manufacturers.

The original manufacturer’s datasheet accompanying this document reflects the performance

and specifications of the Rochester manufactured version of this device. Rochester Electronics

guarantees the performance of its semiconductor products to the original OEM specifications.

‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be

based on product characterization, design, simulation, or sample testing.

To learn more, please visit

www.rocelec.com

D8755A-2 Related Products

	D8755A-2	TD8755A	QD8755A	LD8755A	D8755A
Description	Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40	Parallel I/O Port, 16 I/O, MOS, CDIP40, CERDIP-40	Parallel I/O Port, 16 I/O, MOS, CDIP40, CERDIP-40	Parallel I/O Port, 16 I/O, MOS, CDIP40, CERDIP-40	Parallel I/O Port, 16 I/O, MOS, CDIP40, CERDIP-40
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40
length	52.325 mm	52.325 mm	52.325 mm	52.325 mm	52.325 mm
Number of I/O lines	16	16	16	16	16
Number of ports	2	2	2	2	2
Number of terminals	40	40	40	40	40
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Maximum seat height	5.72 mm	5.72 mm	5.72 mm	5.72 mm	5.72 mm
surface mount	NO	NO	NO	NO	NO
technology	CMOS	MOS	MOS	MOS	MOS
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches	1	1	1	1	1
Maximum operating temperature	70 °C	-	70 °C	-	70 °C
Maximum supply voltage	5.25 V	-	5.25 V	-	5.25 V
Minimum supply voltage	4.75 V	-	4.75 V	-	4.75 V
Nominal supply voltage	5 V	-	5 V	5 V	5 V
Temperature level	COMMERCIAL	-	COMMERCIAL	-	COMMERCIAL

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