EEWORLDEEWORLDEEWORLD

Part Number

Search

B32656S0274KT4

Description
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1000V, 0.27uF, CHASSIS MOUNT, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size1MB,7 Pages
ManufacturerEPCOS (TDK)
Environmental Compliance  
Download Datasheet Parametric View All

B32656S0274KT4 Overview

CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1000V, 0.27uF, CHASSIS MOUNT, ROHS COMPLIANT

B32656S0274KT4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1738054256
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.27 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
JESD-609 codee3
Installation featuresCHASSIS MOUNT
negative tolerance10%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)1000 V
surface mountNO
Terminal surfaceMatte Tin (Sn)
Terminal shapeLUG
Film capacitors
MKP Snubbers
Series/Type:
B32656S
Ordering code:
Date:
Version:
August 2007
2
Content of inside pages of data sheet. Data will be automatically entered into frontpage
headlines, headers and footers. Please fill in the table and then change the colour to “White”.
This ensures that the table disappears for the customer pdf.
Identification/Classification 1:
(header 1)
Identification/Classification 2:
(header 2)
Ordering code:
Series/Type:
Preliminary data (optional):
(if necessary)
Department:
Date:
FK DC PM
August 2007
B32656S
Film capacitors
MKP Snubbers
©
EPCOS AG 2007. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Design and FPGA implementation of digital on-screen display control core.pdf
Design and FPGA implementation of digital on-screen display control core.pdf...
zxopenljx FPGA/CPLD
[Atmel SAM R21 Creative Competition Weekly Plan] Problems with IAR development platform compilation in Week 2
[i=s]This post was last edited by 770781327 on 2014-12-27 21:46[/i] In the past two days, I have been struggling with how to port the routines of atmel studio. I saw that many forum friends ported the...
770781327 Microchip MCU
I2C driver framework source code analysis (2)
c. I2C device driver. As mentioned earlier, there are two ways to implement the I2C device layer driver. We choose the user mode device driver. This driver depends on the i2c-dev driver in the I2C sub...
宋元浩 Linux and Android
my country establishes robot testing and certification system
[align=center][b]my country Establishes Robot Testing and Certification System[/b][/align][align=left]In order to promote the steady improvement of robot product quality and promote the healthy and or...
W18027000085 Robotics Development
Memory operation question
WinCE 6.0 applications cannot directly access memory. Why is this? What is the reason? Can WinCE 5 do this? Why can't I simulate it? Can't I simulate it even if I use MAP to virtual address?...
ccccwoele Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1013  2724  1050  2045  1512  21  55  22  42  31 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号