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DS1-316-2AR

Description
IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
CategoryThe connector    socket   
File Size30KB,2 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

DS1-316-2AR Overview

IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

DS1-316-2AR Parametric

Parameter NameAttribute value
MakerThomas & Betts Corporation
Reach Compliance Codeunknow
ECCN codeEAR99
Other features.01uF CAPACITOR
body width0.4 inch
subject depth0.165 inch
body length0.8 inch
Contact to complete cooperationAU ON NI
Contact completed and terminatedGOLD
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP16
Dielectric withstand voltage1000VAC V
Shell materialEPOXY
Insulation resistance5000000000 Ω
Manufacturer's serial numberDS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts16
Maximum operating temperature85 °C
Minimum operating temperature10 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.3 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
DS Series
A
Capacitor Socket With Four-Finger Contact
DS1-316-1AR
FEATURES:
Augat has combined its four-finger high reliability contact with a surface
mount capacitor and a circuit assembly to create a full line of decoupling
(dual-in-line) sockets.
• Available in three lead termination styles, .125" (3,18) PC tail,
.180" (4,57) PC tail and 3-level solderless wire wrap
• Reduces PCB utilized space by 12% to 15%
• Allows handling, inventory and installation of one component
instead of two
• Available in three capacitor values: .01µF, .10µF and .33µF
• Optional assignment of voltage and ground available for custom
decoupling requirements, consult factory
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1, Cond. II
Shock .............................. Passed MIL-STD-1344, Method 2004.1, Cond. C
Durability ...................... Passed 50 cycles
Normal Force ................ 115 Grams (4.1 0z.) min. with .018" (0,46) dia.
polished steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Solderability .................. Passed MIL-STD-202, Method 208
Insertion Force .............. 179 Grams (6.3 oz.) average with .018" (0,46) dia.
polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with .018" (0,46) dia.
polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202F, Method 305
(adjacent contacts max.)
Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 VAC RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Moisture Resistance ...... Passed MIL-STD-202, Method 106
Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temp.* .......... +10°C to +85°C
* This temperature range applies to the capacitor only
APPLICATION DIMENSIONS:
• PCB Hole Size Range: .055"
±
.003" (1,40
±
0,08) Solderless wrap
.035"
±
.003" (0,89
±
0,08) PC solder termination
• IC Pin Dimension Range: .016" to .021" (0,41 to 0,53) dia.
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Glass epoxy
Outer Sleeve .................. Machined brass/formed copper,
tin/lead or gold plated
Inner Contact .................. Beryllium copper, gold over nickel
or tin/lead plated
Quality & Innovation From The
Product Group
A20
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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