UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | WDIP, |
| Contacts | 24 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| Other features | POWER SWITCHED PROM |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 31.877 mm |
| memory density | 16384 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8868002LA | 5962-8868003LA | 5962-8868001LA | 5962-8868004LA | 5962-8873403LA | |
|---|---|---|---|---|---|
| Description | UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | UVPROM, 2KX8, 30ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | UVPROM, 2KX8, 50ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | OTP ROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP |
| package instruction | WDIP, | WDIP, | WDIP, | WDIP, | CERAMIC, DIP-24 |
| Contacts | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 35 ns | 30 ns | 50 ns | 25 ns | 35 ns |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 31.877 mm | 31.877 mm | 31.877 mm | 31.877 mm | 31.877 mm |
| memory density | 16384 bi | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP | WDIP | WDIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Other features | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | POWER SWITCHED PROM | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |