|
5962R9572001VCX |
5962R9572001VXX |
HCS11DMSH |
HCS11KMSH |
| Description |
AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, CDIP14 |
AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, CDFP14 |
AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, CDIP14 |
AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, CDFP14 |
| Reach Compliance Code |
unknow |
unknown |
unknown |
unknown |
| Other features |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| series |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
| JESD-30 code |
R-CDIP-T14 |
R-CDFP-F14 |
R-CDIP-T14 |
R-CDFP-F14 |
| Logic integrated circuit type |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
| Number of functions |
3 |
3 |
3 |
3 |
| Number of entries |
3 |
3 |
3 |
3 |
| Number of terminals |
14 |
14 |
14 |
14 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
FLATPACK |
IN-LINE |
FLATPACK |
| propagation delay (tpd) |
20 ns |
20 ns |
25 ns |
25 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
NO |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal form |
THROUGH-HOLE |
FLAT |
THROUGH-HOLE |
FLAT |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |