CHEMTRONICS
Technical Data Sheet
TDS # SWNoClean
Soder-Wick
No Clean
Desoldering Braid
PRODUCT DESCRIPTION
Soder-Wick
No Clean is designed to
provide fast and safe desoldering without
leaving behind harmful flux residues.
Soder-Wick
No Clean uses pure, oxygen
free copper braid and a patented flux
technology to make an efficient and
effective desoldering braid. Soder-Wick
No Clean SD is available on ESD safe
bobbins for protection against damage due
to static electricity.
Requires little or no post solder cleaning
No corrosive residues
Halide free
ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C
Minimal risk of heat and static
component damage
TYPICAL APPLICATIONS
Soder-Wick
No Clean safely removes
solder from:
Lugs and Posts
Micro Circuits
Surface Mount Device Pads
Ball Grid Array Pads
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Surface Insulation Resistance
Bellcore TR-NWT-000078
: PASS
4
After 96 Hours (megohms) 2 x 10 Limit
Group A
4.8 x 10
6
Group B
3.8 x 10
6
Group C
4.1 x 10
6
: PASS
ANSI/IPC J SF-818
8
After 168 Hours (ohms) 1.8 x 10 Limit
1-2
2.3 x 10
10
2-3
2.6 x 10
10
3-4
2.8 x 10
10
4-5
2.8 x 10
10
Electromigration
: PASS
Average Insulation Resistance
(megohms)-One Decade Limit
Initial
Final
3
Group E
3.93 x 10
1.24 x 10
4
Group F
3.87 x 10
3
2.84 x 10
4
At 10x magnification no evidence of
electromigration or heavy corrosion.
Silver Chromate Test Paper
Copper Mirror Test
Shelflife
PASS
PASS
2 years
SODER-WICK
NO CLEAN MEETS OR
EXCEEDS:
MIL-F-14256F, Type R
DOD-STD-883E, Method 2022
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
AVAILABILITY
Part #
1
2
3
4
5
6
BGA
Size Inches
.030”
.060”
.080”
.110”
.145”
.210”
-
Color
White
Yellow
Green
Blue
Brown
Red
Purple
Size Metric
.76mm
1.52mm
2.03mm
2.79mm
3.68mm
5.33mm
-
Part #
60-1-5
60-2-5
60-3-5
60-4-5
60-5-5
60-6-5
Size
1
2
3
4
5
6
Length
5
5
5
5
5
5
Part #
60-1-10
60-2-10
60-3-10
60-4-10
60-5-10
Size Length
1
2
3
4
5
10
10
10
10
10
VacuPak
Packaging
USAGE INSTRUCTIONS
1) Choose a Soder-Wick
No Clean width equal to
or slightly larger than the pad or connection.
2) Choose a solder iron tip equal to or slightly
larger than the pad or connection.
3) Set temperature of iron between 600-750°F.
4) Place wick on solder joint and place tip of hot
iron on top of wick.
5) As solder becomes molten, the color of the wick
will change from copper to silver.
6) Remove wick and iron from joint
simultaneously once color change has stopped.
7) The component lead / pad is now clean and free
from solder.
8) Clip and discard used portion of the wick.
Part #
SW16015
SW16025
SW16035
SW16045
SW16055
SW160BGA
Size
1
2
3
4
5
BGA
For industrial use only.
Read MSDS carefully prior to use.
The VacuPak Can contains
ten five-foot bobbins in a
vacuum sealed can. This
package provides the highest
level of cleanliness and
freshness. Great for tool kit
storage.
NOTE:
This information is believed to be accurate. It is
intended for professional end users having the skills
to evaluate and use the data properly. Chemtronics
does not guarantee the accuracy of the data and
assumes no liability in connection with damages
incurred while using it.
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to
answer your technical and application
related questions. The toll free number is:
1-800-TECH-401.
Chemtronics, Soder-Wick and CircuitWorks are
registered trademarks of Chemtronics. All rights reserved.
VacuPak is a trademark of Chemtronics. All rights reserved.
CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888
DISTRIBUTED BY:
REV. F (08/13)
Medical Electronics
京公网安备 11010802033920号
EEWORLD
