SnPb end metallization option available upon request
(5% Pb minimum)
Applications
Typical applications include military, space quality and high reliability electronics.
Packaging C-Spec Ordering Options Table (100% Matte Sn and SnPb Terminations)
Packaging Type
1
Bulk Bag/Unmarked
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case
size devices with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options
may be available. Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Additional reeling or packaging options may be available. Contact KEMET for details.
I am using MSPf2121. Not long ago, when I was repairing some broken boards, I found that after the external crystal oscillator on the board was removed, the TimeA interrupt event using ACLK as the clo...
I recently designed a circuit for a project. The main control chip is STM32F103CVT6. I want to use an LCD touch screen, but I can't find a suitable model. Can experts recommend a 4.3-inch or 4.7-inch ...
National Engineering Research Center for Converter TechnologyThe National Engineering Research Center for Converter Technology sincerely invites distributors from all over the country. Since its estab...
I use MSP430F5529LaunchPad development board for UART serial port debugging. I use IAR, but the result of the echo is that either no data is echoed or only the same string of data appears forever. I h...
Sailing is gaining more and more attention. How to use modern technology to assist training and improve competition results is particularly important. Considering the real-time data collection in t...[Details]
China's new energy vehicles are in a transition period from research and development to real industrial development. In 2012, with the intensive launch of new energy vehicle policy planning, the de...[Details]
Microcontrollers (MCUs), which are widely used in automotive electronics, are rapidly facing time and cost pressures. The main advantage of using MCUs has always been to create high-level system in...[Details]
With the continuous improvement of the requirements of intelligent building security systems and the continuous improvement of people's safety awareness, indoor anti-theft has gradually attracted peop...[Details]
From the PIC16F946 datasheet, we know that there are two ways to write values to the LCD for display:
1. Directly write the value to LCDDATA1~LCDDATA23
2. Use disconnect t...[Details]
A multi-point temperature control heating control system was designed using the SST89E564RC single-chip microcomputer and a new temperature measuring device. The heating system can be controlled in...[Details]
I. Introduction
Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
my country is a big country in agriculture, grain production and consumption. Grains are a necessary condition for our nation to survive and develop. The flour processing industry will exist forever w...[Details]
Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
This paper designs a 16x16LED Chinese character display bar based on single-chip dynamic scanning control, briefly analyzes the principle of Chinese character display, and studies how the LED displ...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
LED technology has made rapid progress, and improvements in chip design and materials have promoted the development of brighter and more durable light sources, and the scope of light source applica...[Details]
LED lighting: Basic circuit design can be completed in as little as one day
Semiconductor manufacturers are also getting involved in the LED lighting business. The power circuit of LED req...[Details]
With the rapid development of wireless
digital communication
, more challenges have been raised for integrated circuit design and testing. In the product design stage, in order to ensure
t...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
