F-218 (Rev 06NOV17)
QSE–028–01–F–D–DP–A
®
QSE–020–01–L–D–A
QSE–060–01–F–D–A
(0.80 mm) .0315"
QSE SERIES
HIGH-SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contacts:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QTE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Blade &
Beam
Design
Integral metal plane
for power or ground
POWER/SIGNAL
APPLICATION
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH-SPEED CHANNEL PERFORMANCE
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com
HIGH MATING
CYCLES
QSE-D/QTE-D
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
14 28
G b p s
G b p s
QSE-DP/QSE-DP
QSE
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
1-DH1
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
(40 total pins per bank = –D)
–020, –040, –060
–014, –028, –042
(14 pairs per bank = –D–DP)
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–F
= Single-
Ended
–D
= Guide Post
(–020 only)
–GP
–K
FILE NO. E111594
PROTOCOLS
• 100 GbE
• XAUI
• PCI Express
®
• SATA
• MGT (Rocket I/O)
• InfiniBand
™
–D–DP = (No. of Positions per Row/14) x
(20.00) .7875 + (1.27) .050
–D = (No. of Positions per Row/20) x
(20.00) .7875 + (1.27) .050
02
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= Differential
Pair
(–01 only)
–D–DP
= (8.25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
(20.00) .7875
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Retention, Guide Posts and
Friction Lock options.
Contact Samtec.
(7.24)
.285
01
(0.80)
.0315
(0.15)
.006
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ"
(7.49)
.295
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50 µ"
(3.25)
(1.27 µm) min Ni on
.128
all solder tails
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–C*
= Tape & Reel
Packaging
–TR
–L
= Latching Option
(N/A on –042
& –060 positions)
QTE
MATED HEIGHT
LEAD STYLE
WITH QSE*
(3.05)
.120
(0.76)
.030
(0.89)
.035
DIA
(0.64)
.025
–L
–01
–02
–03
–04
–05
–07
–09
(5.00) .197
(8.00) .315
(11.00) .433
(16.00) .630
(19.00) .748
(25.00) .984
(14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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