F-219
QTS–025–01–L–D–A
®
QTS–075–01–F–D–A
QTS–050–01–F–D–A
(0.635 mm) .025"
QTS SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
1.8 A per pin
(2 pins powered)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSS
Cable Mates:
SQCD
Standoffs:
SO
Integral metal plane
for power or ground
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
POWER/SIGNAL
APPLICATION
(0.635 mm)
.025"
pitch
Alignment
Pin
HIGH-SPEED CHANNEL PERFORMANCE
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
QTS/QSS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
25
G b p s
Polarized
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QTS
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart.
PLATING
OPTION
D
A
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
FILE NO. E111594
= 10 µ" (0.25 µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
–L
= (7.00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
–K
= Tape & Reel
–TR
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
01
(No. of Positions per Row/25) x (20.00) .7875
(20.00) .7875
(7.11)
.280
(5.97)
.235
02
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50 µ" (1.27 µm)
min Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
LEAD
STYLE
–C*
(0.635) .025
(0.20) .008
A
(4.27) .168
(7.26) .286
MATED
HEIGHT
(5.00) .197
(8.00) .315
A
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.76)
.030
(0.89)
.035
DIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
–01
–02
Processing conditions will affect
mated height. See SO Series
for board space tolerances
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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