4
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
20
3
2
REVISIONS
P
LTR
DESCRIPTION
1
DATE
DWN
APVD
C
COPYRIGHT
20
H1
REVISED PER ECR-16-011494
22JUN2017
NK
CX
DIM X # 0.39
D
1.30
HOUSING
D
HOLDDOWN
CONTACT
CONTACT
7.37
-H-
STANDOFF SURFACES
DIM Y
11.16
15.63
0 # 0.1 3
5
SCALE
5:1
C
DIM Z
1.27
3
( 0.635 )
6
6
6
6
6
6
2.92
6
6
6
1.65
0.08
6
6
SUPERSEDED BY 5-794628-4
SUPERSEDED BY 5-794628-2
6
2
2
2
2
2
2
2
2
2
2
2
2
FINISH
DWN
CHK
DIMENSIONS:
36.86
33.86
30.86
27.86
24.86
21.86
18.86
15.86
12.86
9.86
6.86
3.86
36.86
33.86
30.86
27.86
24.86
21.86
18.86
15.86
12.86
9.86
6.86
3.86
DIM Y
K. WHITAKER
C. JONES
40.79
37.79
34.79
31.79
28.79
25.79
22.79
19.79
16.79
13.79
10.79
7.79
40.79
37.79
34.79
31.79
28.79
25.79
22.79
19.79
16.79
13.79
10.79
7.79
DIM W
19MAR2003
19MAR2003
19MAR2003
33.00
30.00
27.00
24.00
21.00
18.00
15.00
12.00
9.00
6.00
3.00
-
33.00
30.00
27.00
24.00
21.00
18.00
15.00
12.00
9.00
6.00
3.00
-
DIM Z
40.00
37.00
34.00
31.00
28.00
25.00
22.00
19.00
16.00
13.00
10.00
7.00
40.00
37.00
34.00
31.00
28.00
25.00
22.00
19.00
16.00
13.00
10.00
7.00
DIM X
24
22
20
18
16
14
12
10
8
6
4
2
24
22
20
18
16
14
12
10
8
6
4
2
NO. OF
POSN.
5- 794628 -4
5- 794628 -2
5- 794628 -0
4- 794628 -8
4- 794628 -6
4- 794628 -4
4- 794628 -2
4- 794628 -0
3- 794628 -8
3- 794628 -6
3- 794628 -4
3- 794628 -2
2- 794628 -4
2- 794628 -2
2- 794628 -0
1- 794628 -8
1- 794628 -6
1- 794628 -4
1- 794628 -2
1- 794628 -0
794628 -8
794628 -6
794628 -4
794628 -2
PART NUMBER
TE Connectivity
C
EDGE OF BOARD
( 1.46 )
3.00
DIM Z
10.1
5.48
CIRCUIT 1
B
1
MATERIAL;
CONTACTS - BRASS.
HOUSING - UL 94V-0 RATED HIGH TEMP NYLON,
COLOR; BLACK.
HOLDDOWNS - PHOSPHOR BRONZE.
PLATING;
CONTACTS - 0.38µm MINIMUM GOLD OVER 2.54µm
MINIMUM NICKEL ON MATING AREA.
2.54µm TIN-LEAD MINIMUM OVER 2.54µm
NICKEL MINIMUM ON SOLDER TAIL.
HOLDOWNS - 2.54µm TIN-LEAD.
DIMENSION APPLIES TO SOLDERTAIL SURFACES
AND STANDOFF SURFACES.
RECOMMENDED PC BOARD THICKNESS OF 1.57.
ALL SOLDERTAILS AND HOLDDOWNS.
PLATING;
CONTACTS - 0.38µm MINIMUM GOLD OVER
MINIMUM NICKEL ON MATING
2.54µm MATTE TIN MINIMUM
NICKEL MINIMUM ON SOLDER
HOLDOWNS - 2.54µm MATTE TIN.
2.54µm
AREA.
OVER 2.54µm
TAIL.
5.65
MIN
( 0.825 )
3.895
( 1.715 )
3.43
TYP
0.08
SUPERSEDED BY 5-794628-0
SUPERSEDED BY 4-794628-8
SUPERSEDED BY 4-794628-6
SUPERSEDED BY 4-794628-4
SUPERSEDED BY 4-794628-2
SUPERSEDED BY 4-794628-0
SUPERSEDED BY 3-794628-8
4
SUPERSEDED BY 3-794628-6
SUPERSEDED BY 3-794628-4
SUPERSEDED BY 3-794628-2
B
2
EDGE OF BOARD
3 MIN
DIM W
RECOMMENDED PCB LAYOUT
(COMPONENT SIDE)
3
4
5
6
THIS DRAWING IS A CONTROLLED DOCUMENT.
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
A
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
-
0.13
-
-
PRODUCT SPEC
C. JONES
NAME
A
APPLICATION SPEC
-
-
1
1471-9 (3/13)
SEE TABLE
WEIGHT
-
-
CUSTOMER DRAWING
A2
00779
SIZE
SURFACE MOUNT,RIGHT ANGLE,SURFACE
MOUNT HOLDDOWN,ASSEMBLY,15 GOLD
HEADER,DUAL ROW,MICRO MATE-N-LOK
CAGE CODE
DRAWING NO
TM
RESTRICTED TO
794628
SCALE
4:1
SHEET
1
OF
1
REV
-
H1
NXP MCU
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