EEWORLDEEWORLDEEWORLD

Part Number

Search

37303-3122-000 FL 500

Description
conn socket 3 pos idc 24-26awg
CategoryThe connector   
File Size2MB,9 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance  
Download Datasheet Parametric View All

37303-3122-000 FL 500 Overview

conn socket 3 pos idc 24-26awg

37303-3122-000 FL 500 Parametric

Parameter NameAttribute value
Datasheets
373 Series
Catalog Drawings
373 Series 3-Pi
Featured Produc
Two and Four Position Link Connectors
Standard Package500
CategoryConnectors, Interconnects
FamilyRectangular Connectors - Free Hanging, Panel Mou
PackagingBulk
Connector TypeReceptacle
Contact TypeFemale Socke
Number of Positions3
Pitch0.079" (2.00mm)
Number of Rows1
Row Spacing-
Mounting TypeFree Hanging (In-Line)
Fastening Type-
Cable TerminatiSpring Clam
Wire TypeDiscrete
Wire Gauge24-26 AWG
FeaturesClosed End
Contact FinishGold
Contact Finish Thickness8µin (0.20µm)
ColBlack
Other Names37303-3122-000 FL 500-ND3M572751900100787JE150291746
3M
Mini-Clamp Socket
Designed for Wiring Supplied from Japan and Asia, 2 mm, IDC, Wiremount, Panel Mount
373 Series
• Designed to accommodate typical wiring specifications per
Japanese and Asian suppliers
• Latches available for Panel Mount applications
• No special wire preparation
• Integrated cable retention
• Design accepts multiple wire size diameters
• Easy, quick, and reliable IDC termination using a standard pliers
• Debris free wire termination
• Accepts plug latches for a reliable interconnection in demanding
applications
• High number of mating cycles
• Compact design saves board and panel space
• Reduces maintenance work by providing higher connection
reliability
• See Regulatory Information Appendix (RIA) for chemical
compliance information
Date Modified: April 2, 2008
TS-2094-C
Sheet 1 of 6
Physical
Insulation:
Material: Glass reinforced thermoplastic body and lower cover, transparent thermoplastic cover
Flammability: UL 94V-0
Color: Black body, cover—white and color (see Table 1)
Contact Material:
Copper Alloy
Plating:
Underplating: 2.54 µm [100 µ”] minimum Nickel
Wiping Area: 0.2 µm [8 µ”] minimum Gold with Lubricant
IDC: Nickel
Accommodation: Annealed Copper, high-strength Copper or Copper Alloy. Bare, tinned, or tin
overcoated, 20 ~ 26 AWG [ 0.14 ~ 0.5 ] stranded
Wire Insulation: Flexible vinyl, semi-rigid vinyl, x-linked polyethylene, or ETFE (see Table 1)
Marking:
3M Logo, Position Indicator, Wire Gauge, Insulator Material
Electrical
Current Rating:
Voltage Rating:
Insulation Resistance:
Withstanding Voltage:
3.0 Amps
32 Volts
>1 x 10
6
Ω
at 600 V
DC
1,000 V
RMS
at sea level
Environmental
Temperature Rating:
20°C to +85°C ambient (1.0 A max.)
-20°C to +75°C ambient (2.0 A max.)
-20°C to +60°C ambient (3.0 A max.)
(Note: UL rating is 65°C at 3.0A, 32V)
UL File No.: E68080
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
[Linux learning notes] Part 2: The whole process of burning Debian system
[i=s]This post was last edited by wo4fisher on 2016-11-10 00:56[/i] [align=left][font=宋体][size=3][color=#000000]1. Preparation:[/color][/size][/font][/align] [align=left][font=宋体][size=3][color=#00000...
wo4fisher Linux and Android
The Enlightenment of Passive Optical Networks
[size=4][color=#000000][backcolor=white]The number of cloud data centers is growing rapidly. According to some analysts, by 2020, the installed base of major cloud providers will triple. This growth i...
fish001 Wireless Connectivity
There is a problem adding USB CDC function in the official demo application SDDataLog
There is a problem when adding USB CDC function in the official demo application SDDataLog. When sensorile is plugged into the PC USB port, the virtual serial port can be recognized normally at first....
xujinxi ST MEMS Sensor Creative Design Competition
Control the car by transmitting key information during a mobile phone call
As the title says, I have seen someone use a chip to decode the key frequency transmitted during a mobile phone call, and then input it into a 51 single-chip microcomputer to achieve wireless remote c...
浪琴湾 RF/Wirelessly
EEWORLD University Hall----Using TI solutions to provide power for Xilinx's new FPGA (Part 3)
Using TI solutions to provide power for Xilinx's new FPGA (Part 3) : https://training.eeworld.com.cn/course/149...
zhangjianee Power technology
Single chip microcomputer and ultrasonic ranging? ?
How to write the ultrasonic speed measurement program? It is best to use C and microcontroller control. Thank you...
zzp6682 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2846  2191  1891  2889  734  58  45  39  59  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号