D55342H07W68B1M-W datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> D55342H07W68B1M-W

D55342H07W68B1M-W: DescriptionRESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 68100 ohm, SURFACE MOUNT, 1206, CHIP; CategoryPassive components The resistor; File Size106KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

Download Datasheet Parametric View All

D55342H07W68B1M-W Overview

RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 68100 ohm, SURFACE MOUNT, 1206, CHIP

D55342H07W68B1M-W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	7024341424
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	7.35
Other features	PRECISION
structure	Chip
JESD-609 code	e4
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.46 mm
Package length	3.2 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.55 mm
method of packing	WAFFLE PACK
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	68100 Ω
Resistor type	FIXED RESISTOR
size code	1206
surface mount	YES
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Terminal surface	Gold (Au)
Terminal shape	WRAPAROUND
Tolerance	0.1%
Operating Voltage	100 V

Preview

Download Datasheet

View All

State of the Art, Inc.

Thin Film Chip Resistor

D55342/07 RM1206

PROTECTIVE

ENCAPSULANT

PRECISION

THIN FILM

RESISTOR

99.6% ALUMINA CHIP

WRAPAROUND

TERMINATIONS

PRETINNED

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

100

- 1M

0.1%, 1%, 2%, 5%

250 mW

100 Volts

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

CHARACTERISTICS*

±25

±0.1%

±0.2%

±0.5%

±0.1%

±50

±0.25%

±0.1%

±0.25%

±0.4%

±0.5%

±0.2%

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

D55342 H 07 B 100D R - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

TERMINATION MATERIALS:

SIZE CODE: /07* = RM1206

TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.

B: Solderable wraparound

A: 0.1%

D: 1%

G: 2%

J: 5%

B: 0.1% K

E: 1% K

H: 2% K

K: 5% K

C: 0.1% M

F: 1% M

T: 2% M

L: 5% M

W: Gold wire bondable

MECHANICAL

INCHES

MILLIMETERS

.156

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.126 (.118 - .134)

.061 (.058 - .068)

.018 (.015 - .033)

.016 (.010 - .025)

.018 (.010 - .025)

.090 (.086 - .094)

.0084 grams

3.20

1.55

0.46

0.41

0.46

2.29

(3.00 - 3.40)

(1.47 - 1.73)

(0.38 - 0.84)

(0.25 - 0.64)

(2.18 - 2.39)

.067

.084

.036

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

Recommended Resources

10LED level meter circuit using dual driver integrated circuit

AC220V voltage stabilization to DC5V circuit

Voice-activated power socket made of transistors

Four-way remote control AC switch

Production of infrared receiving controller

Sony's high-quality FM stereo receiver chip CXA1238M

CC2640 Software Architecture: At the highest level, the CC2640 Bluetooth software environment consists of three parts: a real-time operating system (RTOS), an application map, and a stack map. TI-RTOS is a real-time, preemptive, m...; Jacktang Wireless Connectivity

The STM32 library to be used on the previous sub-board: ...; damiaa ADI Reference Circuit

Microcontrollers and their applications, Southeast University (video tutorial, 32 lectures): [url=http://www.714e.com/bbs/display.asp?UserID=33275]http://www.714e.com/bbs/display.asp?UserID=33275[/url]...; 风于韧 MCU

About Double Byte: The following two variables are defined for double bytes, *pANSI1 and pANSI2. The values are "Name: Li Hualiu; Position: Employee; Department: Terminal R&D Department; Company: ert;" Now I want to cha...; ssnh6688 Embedded System

Does USB ActiveSync require additional components or modifications?: I want to use the synchronization method to test the CE program these days. Currently, the synchronization method using COM is feasible! But I don’t know why I can’t synchronize using USB! Let me firs...; akpor Embedded System

Recruiting senior analysts in the electronics industry: 【Job Responsibilities】 1. Conduct in-depth research on the entire industry chain of the electronics industry, especially in the field of import substitution, and continuously provide industry analysis...; Miachaelzhangsl Talking about work

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components