| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | QFP |
| package instruction | 14 X 20 MM, MINI, PLASTIC, QFP-100 |
| Contacts | 100 |
| Reach Compliance Code | unknow |
| Has ADC | NO |
| Other features | BUILT-IN DYNAMIC RAM REFRESH CONTROLLER |
| Address bus width | 16 |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 10 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 20 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 2 |
| Number of I/O lines | 16 |
| Number of serial I/Os | 2 |
| Number of terminals | 100 |
| Number of timers | 4 |
| On-chip data RAM width | |
| On-chip program ROM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -10 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.7X.9 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| rom(word) | 0 |
| Maximum seat height | 3.05 mm |
| speed | 10 MHz |
| Maximum slew rate | 55 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| width | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
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